Invention Grant
- Patent Title: Electronic device with a package-level thermal regulator mechanism and associated systems, devices, and methods
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Application No.: US15910590Application Date: 2018-03-02
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Publication No.: US10692793B2Publication Date: 2020-06-23
- Inventor: Mark E. Tuttle
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Perkins Coie LLP
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L25/10 ; H01L23/31 ; H01L21/56 ; H01L25/00 ; H01L25/18 ; H01L23/38
Abstract:
A semiconductor device includes a substrate; a die attached to the substrate; an encapsulation covering the substrate and the die, wherein the die is embedded within the encapsulation; and a heating element embedded within the encapsulation, wherein the heating element is configured to provide thermal energy to the die.
Public/Granted literature
Information query
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