- 专利标题: Semiconductor chip having tampering feature
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申请号: US16138971申请日: 2018-09-22
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公开(公告)号: US10692821B2公开(公告)日: 2020-06-23
- 发明人: Ali Afzali-Ardakani , Joel P. de Souza , Bahman Hekmatshoartabari , Daniel M. Kuchta , Devendra K. Sadana
- 申请人: International Business Machines Corporation
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理机构: Otterstedt, Wallace & Kammer, LLP
- 代理商 L. Jeffrey Kelly
- 主分类号: H01L23/00
- IPC分类号: H01L23/00 ; H01L31/112 ; H01L21/762 ; H01L31/02 ; H01L31/0203 ; H01L31/0216 ; H01L31/0224 ; H01L31/024 ; H01L31/0376 ; H01L31/14 ; H01L31/20 ; H01L27/144 ; H01L29/49
摘要:
Silicon-based or other electronic circuitry is dissolved or otherwise disabled by reactive materials within a semiconductor chip should the chip or a device containing the chip be subjected to tampering. Triggering circuits containing normally-OFF heterojunction field-effect photo-transistors are configured to cause reactions of the reactive materials within the chips upon exposure to light. The normally-OFF heterojunction field-effect photo-transistors can be fabricated during back-end-of-line processing through the use of polysilicon channel material, amorphous hydrogenated silicon gate contacts, hydrogenated crystalline silicon source/drain contacts, or other materials that allow processing at low temperatures.
公开/授权文献
- US20190035748A1 SEMICONDUCTOR CHIP HAVING TAMPERING FEATURE 公开/授权日:2019-01-31
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