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公开(公告)号：US20190123830A1
公开(公告)日：2019-04-25
申请号：US16220782
申请日：2018-12-14
发明人： Alessandro Cevrero , Daniel M. Kuchta , Christian I. Menolfi , Thomas E. Morf , Ilter Özkaya , Marc A. Seifried
IPC分类号： H04B10/50 , H04B10/564 , H04Q11/00 , H04B10/508
CPC分类号： H04B10/503 , H01S5/0014 , H01S5/0428 , H01S5/06216 , H01S5/183 , H04B10/508 , H04B10/564 , H04B2210/08 , H04Q11/0003
摘要： Devices and methods are provided to reduce the wake-up time of a Vertical Cavity Surface Emitting Laser (VCSEL) used in a data communication link. For example, in one aspect, a method for optical communications includes, in an optical communication device including a light-emitting device, applying a bias current to the light-emitting device and transmitting a pulse to the light-emitting device before transmitting a preamble signal or data signal to the light-emitting device, wherein the pulse has a voltage greater than a highest voltage of the preamble signal or data signal.
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公开(公告)号：US10169288B2
公开(公告)日：2019-01-01
申请号：US15140034
申请日：2016-04-27
IPC分类号： G06F15/173 , G06F15/16 , G06F15/163 , H04B10/25 , H04L5/14
摘要： Node interconnect architectures to implement a high performance supercomputer are provided. For example, a node interconnect architecture for connecting a multitude of nodes (or processors) of a supercomputer is implemented using an all-to-all electrical and optical connection network which provides two independent communication paths between any two processors of the supercomputer, wherein a communication path includes at most two electrical links and one optical link.
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公开(公告)号：US09927574B2
公开(公告)日：2018-03-27
申请号：US15420668
申请日：2017-01-31
CPC分类号： G02B6/125 , G02B6/12 , G02B6/136 , G02B6/3652 , G02B6/423 , G02B6/4243 , G02B2006/12119 , G02B2006/12147 , G02B2006/12166 , G02B2006/12173 , G02B2006/12176 , Y10T156/10
摘要： An optical component includes a component body, and at least one angled-facet waveguide formed in the component body, wherein the angled-facet waveguide is substantially mirror-symmetrical in shape relative to a line at or near the center of the angled-facet waveguide.
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公开(公告)号：US09857531B2
公开(公告)日：2018-01-02
申请号：US15342566
申请日：2016-11-03
CPC分类号： G02B6/125 , G02B6/12 , G02B6/136 , G02B6/3652 , G02B6/423 , G02B6/4243 , G02B2006/12119 , G02B2006/12147 , G02B2006/12166 , G02B2006/12173 , G02B2006/12176 , Y10T156/10
摘要： A system comprises a first optical component comprising at least one waveguide and at least one self-alignment feature; and a second optical component comprising at least another waveguide and at least another self-alignment feature; wherein the self-alignment feature of the second optical component engage to assist in optically-coupling the waveguide of the first optical component and the waveguide of the second optical component when the first optical component has a manufacturing tolerance in a given geometric dimension and is mounted in the second optical component.
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公开(公告)号：US20170117431A1
公开(公告)日：2017-04-27
申请号：US15390647
申请日：2016-12-26
发明人： Ali Afzali-Ardakani , Joel P. de Souza , Bahman Hekmatshoartabari , Daniel M. Kuchta , Devendra K. Sadana
IPC分类号： H01L31/112 , H01L27/144 , H01L23/00
CPC分类号： H01L23/573 , H01L21/762 , H01L23/576 , H01L27/144 , H01L29/4916 , H01L31/02019 , H01L31/0203 , H01L31/02161 , H01L31/022408 , H01L31/024 , H01L31/03762 , H01L31/1129 , H01L31/143 , H01L31/202
摘要： Silicon-based or other electronic circuitry is dissolved or otherwise disabled by reactive materials within a semiconductor chip should the chip or a device containing the chip be subjected to tampering. Triggering circuits containing normally-OFF heterojunction field-effect photo-transistors are configured to cause reactions of the reactive materials within the chips upon exposure to light. The normally-OFF heterojunction field-effect photo-transistors can be fabricated during back-end-of-line processing through the use of polysilicon channel material, amorphous hydrogenated silicon gate contacts, hydrogenated crystalline silicon source/drain contacts, or other materials that allow processing at low temperatures.
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公开(公告)号：US20170117236A1
公开(公告)日：2017-04-27
申请号：US15390626
申请日：2016-12-26
发明人： Ali Afzali-Ardakani , Joel P. de Souza , Bahman Hekmatshoartabari , Daniel M. Kuchta , Devendra K. Sadana
IPC分类号： H01L23/00 , H01L31/02 , H01L31/112 , H01L31/20 , H01L31/14 , H01L31/0224 , H01L31/0376 , H01L31/0216 , H01L31/0203 , H01L31/024
CPC分类号： H01L23/573 , H01L21/762 , H01L23/576 , H01L27/144 , H01L29/4916 , H01L31/02019 , H01L31/0203 , H01L31/02161 , H01L31/022408 , H01L31/024 , H01L31/03762 , H01L31/1129 , H01L31/143 , H01L31/202
摘要： Silicon-based or other electronic circuitry is dissolved or otherwise disabled by reactive materials within a semiconductor chip should the chip or a device containing the chip be subjected to tampering. Triggering circuits containing normally-OFF heterojunction field-effect photo-transistors are configured to cause reactions of the reactive materials within the chips upon exposure to light. The normally-OFF heterojunction field-effect photo-transistors can be fabricated during back-end-of-line processing through the use of polysilicon channel material, amorphous hydrogenated silicon gate contacts, hydrogenated crystalline silicon source/drain contacts, or other materials that allow processing at low temperatures.
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公开(公告)号：US20170082798A1
公开(公告)日：2017-03-23
申请号：US15342566
申请日：2016-11-03
IPC分类号： G02B6/12
CPC分类号： G02B6/125 , G02B6/12 , G02B6/136 , G02B6/3652 , G02B6/423 , G02B6/4243 , G02B2006/12119 , G02B2006/12147 , G02B2006/12166 , G02B2006/12173 , G02B2006/12176 , Y10T156/10
摘要： A system comprises a first optical component comprising at least one waveguide and at least one self-alignment feature; and a second optical component comprising at least another waveguide and at least another self-alignment feature; wherein the self-alignment feature of the second optical component engage to assist in optically-coupling the waveguide of the first optical component and the waveguide of the second optical component when the first optical component has a manufacturing tolerance in a given geometric dimension and is mounted in the second optical component.
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公开(公告)号：US20160172526A1
公开(公告)日：2016-06-16
申请号：US14567805
申请日：2014-12-11
IPC分类号： H01L31/112 , H01L51/42 , H01L31/18 , H01L31/0216
CPC分类号： H01L51/4213 , H01L27/14 , H01L31/1129 , H01L31/1804 , H01L31/20 , H01L51/428 , Y02E10/547 , Y02E10/549 , Y02P70/521
摘要： A semiconductor device that includes a layer of highly crystalline semiconductor material positioned on an insulating substrate. The semiconductor device also includes a source structure and a drain structure positioned on the layer of highly crystalline semiconductor material. The semiconductor device also includes a photoelectric element positioned on the layer of highly crystalline semiconductor material. The photoelectric element forms an electrical junction with the layer of highly crystalline semiconductor material. The photoelectric element is positioned between the source structure and the drain structure. The photoelectric element is also electrically floating.
摘要翻译： 一种半导体器件，包括位于绝缘衬底上的高结晶半导体材料层。 半导体器件还包括位于高结晶半导体材料层上的源极结构和漏极结构。 该半导体器件还包括位于高结晶半导体材料层上的光电元件。 光电元件与高结晶半导体材料层形成电连接。 光电元件位于源极结构和漏极结构之间。 光电元件也是电浮动的。
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公开(公告)号：US20150063755A1
公开(公告)日：2015-03-05
申请号：US14011381
申请日：2013-08-27
CPC分类号： G02B6/02042 , G02B6/3652 , G02B6/4214 , G02B6/423 , G02B6/425 , Y10T29/49826
摘要： An optical connector includes a fiber element incorporating one or more optical fibers, the optical fiber including a plurality of cores, and an optical element including an array of optical waveguides arranged in one or more layers so as to match the geometry of the plurality of cores of the optical fiber.
摘要翻译： 一种光学连接器包括一个包含一个或多个光纤的光纤元件，该光纤包括多个核心，以及一个光学元件，该光学元件包括以一层或多层布置的光波导阵列，以便匹配多个核心的几何形状 的光纤。
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公开(公告)号：US20220328375A1
公开(公告)日：2022-10-13
申请号：US17225075
申请日：2021-04-07
发明人： Mark D. Schultz , Fuad Elias Doany , Benjamin Giles Lee , Daniel M. Kuchta , Christian Wilhelmus Baks
IPC分类号： H01L23/367 , H01L25/16 , G02B6/42
摘要： An optical module includes an optoelectronic assembly and a heat spreader. The optoelectronic assembly includes a flat, rigid substrate, an array of electrical contacts positioned on a first portion of the substrate, and an optoelectronics assemblage that is electrically connected to the array of contacts and is positioned apart from the array of electrical contacts. The heat spreader is comprised of a thermally conductive material and comprises a second portion that is structurally connected to the first portion and a third portion that is thermally connected to the optoelectronics assemblage.
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