Invention Grant
- Patent Title: Multilayers of nickel alloys as diffusion barrier layers
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Application No.: US16038598Application Date: 2018-07-18
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Publication No.: US10692830B2Publication Date: 2020-06-23
- Inventor: Nazila Dadvand , Christopher Daniel Manack , Salvatore Frank Pavone
- Applicant: TEXAS INSTRUMENTS INCORPORATED
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Dawn Jos; Charles A. Brill; Frank D. Cimino
- Main IPC: H01L23/00
- IPC: H01L23/00
Abstract:
A structure for a semiconductor device includes a copper (Cu) layer and a first nickel (Ni) alloy layer with a Ni grain size a1. The structure also includes a second Ni alloy layer with a Ni grain size a2, wherein a1
Public/Granted literature
- US20190109109A1 MULTILAYERS OF NICKEL ALLOYS AS DIFFUSION BARRIER LAYERS Public/Granted day:2019-04-11
Information query
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