Invention Grant
- Patent Title: Ball bond attachment for a semiconductor die
-
Application No.: US16171121Application Date: 2018-10-25
-
Publication No.: US10692835B2Publication Date: 2020-06-23
- Inventor: Han Zhong , Zi Qi Wang , Chen Xiong , Yong Qiang Tang , Xi Lin Li , Xiao Lin Kang
- Applicant: TEXAS INSTRUMENTS INCORPORATED
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Dawn Jos; Charles A. Brill; Frank D. Cimino
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/00 ; H01L21/48 ; H01L21/56 ; H01L21/78
Abstract:
A method for forming a ball bond for an integrated circuit formed on a semiconductor die includes forming a ball at a first send of a conductive wire inserted in a capillary tool and lowering the capillary tool toward a pad on the semiconductor die positioned on a support surface. The method further includes moving, using a motor, the support surface relative to the capillary tool to thereby bond the ball, without using ultrasound, to the pad and then raising the capillary tool.
Public/Granted literature
- US20190378814A1 BALL BOND ATTACHMENT FOR A SEMICONDUCTOR DIE Public/Granted day:2019-12-12
Information query
IPC分类:
