Invention Grant
- Patent Title: Server water cooling modules prevent water leakage device
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Application No.: US15985336Application Date: 2018-05-21
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Publication No.: US10694640B2Publication Date: 2020-06-23
- Inventor: Chao-Jung Chen , Yu-Nien Huang , Ching-Yu Chen , Tsung-Ta Li
- Applicant: QUANTA COMPUTER INC.
- Applicant Address: TW Taoyuan
- Assignee: QUANTA COMPUTER INC.
- Current Assignee: QUANTA COMPUTER INC.
- Current Assignee Address: TW Taoyuan
- Agency: Nixon Peabody LLP
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
This disclosure relates to connecting a metal hose between a radiator and a cold plate that cools a CPU, or similar electronic heat generating component, whereby the metal hose is connected to the radiator with silicon casings. Waterproof spray plates are also provided to direct any water spray away from the electronic components. A water tray beneath the waterproof spray plates collects any water and directs it to a location outside the chassis.
Public/Granted literature
- US20190239386A1 SERVER WATER COOLING MODULES PREVENT WATER LEAKAGE DEVICE Public/Granted day:2019-08-01
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