-
公开(公告)号：US10694640B2
公开(公告)日：2020-06-23
申请号：US15985336
申请日：2018-05-21
申请人： QUANTA COMPUTER INC.
发明人： Chao-Jung Chen , Yu-Nien Huang , Ching-Yu Chen , Tsung-Ta Li
IPC分类号： H05K7/20
摘要： This disclosure relates to connecting a metal hose between a radiator and a cold plate that cools a CPU, or similar electronic heat generating component, whereby the metal hose is connected to the radiator with silicon casings. Waterproof spray plates are also provided to direct any water spray away from the electronic components. A water tray beneath the waterproof spray plates collects any water and directs it to a location outside the chassis.
-
公开(公告)号：US11553620B2
公开(公告)日：2023-01-10
申请号：US17236509
申请日：2021-04-21
申请人： Quanta Computer Inc.
发明人： Chao-Jung Chen , Yu-Nien Huang , Tsung-Ta Li , Guo-Xiang Hu
IPC分类号： H05K7/20
摘要： An immersion liquid cooling tank assembly includes a generally elliptical tank, at least one condenser including a plurality of condenser tubes, at least one cooling fan adjacent to the condenser, a manifold system coupled to the at least one condenser to assist in distributing liquid flow to and from the plurality of condenser tubes, and a top cover disposed over the generally elliptical tank. The top cover includes an air baffle.
-
公开(公告)号：US10453436B2
公开(公告)日：2019-10-22
申请号：US15401976
申请日：2017-01-09
申请人： QUANTA COMPUTER INC.
发明人： Chao-Jung Chen , Yu-Nien Huang , Ching-Yu Chen , Tsung-Ta Li
摘要： An anti-acoustics streamline apparatus is provided. The apparatus includes an air impedance wall having a front face, a rear face, and a plurality of openings extending from the front face to the rear face defining open areas; and a plurality of flow separating structures disposed adjacent to the front face, each of the plurality of flow separating structure extending vertically along the front face of the wall. The openings are configured to define first wall regions in the air impedance wall adjacent to each of the plurality of flow separating structures and second wall regions between the first wall regions. A first ratio of the open areas in the first wall regions to a total area in first wall regions is less than a second ratio of the open areas in the second wall regions to a total area in the second wall regions.
-
公开(公告)号：US09915985B1
公开(公告)日：2018-03-13
申请号：US15397418
申请日：2017-01-03
申请人： QUANTA COMPUTER INC.
发明人： Chao-Jung Chen , Yu-Nien Huang , Ching-Yu Chen , Tsung-Ta Li
CPC分类号： G06F1/20 , H05K7/20145 , H05K7/20618 , H05K7/20727 , H05K7/20736
摘要： A computing system includes a chassis having an airflow entrance and an airflow exhaust, a duct structure disposed in the chassis, and a redirection mechanism located on a wall of the duct structure and extending through a cutout in the wall of the duct structure. In the computing system, the duct structure has a first end facing the airflow entrance and a second end facing the airflow exhaust. The redirection mechanism has a deflector having an inlet airfoil extending away from the duct structure towards the airflow entrance and at least one exhaust airfoil extending into the duct structure.
-
公开(公告)号：US11197396B2
公开(公告)日：2021-12-07
申请号：US16752367
申请日：2020-01-24
申请人： Quanta Computer Inc.
发明人： Chao-Jung Chen , Yu-Nien Huang , Tsung-Ta Li , Kuo-Wei Lee
摘要： An equipment assembly for cooling heat-generating electrical components is disclosed. The assembly includes a housing for containing a heat-generating electrical component. The housing includes an open end having a planar area. A closed-loop liquid cooling system includes a liquid coolant conduit in proximity to the heat-generating electrical component. The conduit allows circulation of a liquid coolant to extract heat from the heat-generating electrical component. A heat exchanger is fluidly coupled to the liquid coolant conduit to extract heat from circulated liquid coolant within the heat exchanger. The heat exchanger includes a shaped front facing the open end of the housing. The surface area of the shaped front is greater than the planar area of the open end. An air flow system propels ambient air through the shaped front of the heat exchanger.
-
公开(公告)号：US10959352B1
公开(公告)日：2021-03-23
申请号：US16734036
申请日：2020-01-03
申请人： Quanta Computer Inc.
发明人： Chao-Jung Chen , Yu-Nien Huang , Tsung-Ta Li , Chien-Hu Chen
IPC分类号： H05K7/20 , H01L23/473
摘要： A cooling unit having two single piece cold plate pipe components is disclosed. The cooling unit has a first pipe operable to transport coolant. A first cold plate has a top surface with a lateral groove to accept a section of the first pipe. The groove includes a first inlet coupled to a first hole in the section of the first pipe. The groove has a first outlet coupled to a second hole in the section of the first pipe. Coolant is circulated from the first inlet through the cold plate to the first outlet. The section of the first pipe is connected to the first cold plate. A second pipe is operable to transport coolant. A second cold plate is located next to the first cold plate. The second cold plate has a groove to accept a section of the second pipe. The groove includes an inlet coupled to a first hole in the section of the second pipe. The groove includes an outlet coupled to a second hole in the section of the second pipe. The coolant is circulated from the second inlet through the second cold plate to the second outlet. The section of the second pipe is connected to the second cold plate.
-
公开(公告)号：US10512193B1
公开(公告)日：2019-12-17
申请号：US16251776
申请日：2019-01-18
申请人： QUANTA COMPUTER INC.
发明人： Chao-Jung Chen , Yu-Nien Huang , Ching-Yu Chen , Tsung-Ta Li
摘要： The present disclosure describes a cooling chassis for a cooling system of a computer system. The cooling chassis includes a housing configured to allow air to pass through in a housing air flow direction. A first radiator is within the housing. The first radiator is oriented at a first oblique angle relative to the housing air flow direction. A first fan is configured to direct air through the first radiator in a first fan air flow direction oblique to the housing air flow direction.
-
公开(公告)号：US11147191B2
公开(公告)日：2021-10-12
申请号：US16173529
申请日：2018-10-29
申请人： QUANTA COMPUTER INC.
发明人： Chao-Jung Chen , Yu-Nien Huang , Chih-Ming Chen , Tsung-Ta Li
IPC分类号： H05K7/20
摘要： A method of maintaining a server rack within a predetermined temperature range, including the removal of heat from the server rack by both conductive and convective heat transfer. Thermal contact structure is placed between the server rack and a heat sink. The heat sink may be in the form of a housing containing a radiator in one wall, and a bank of fans in an opposite wall to draw a coolant gas through the radiator. The coolant gas contacts the heat sink and a portion of the coolant gas is directed towards the server rack. Cooling liquid is supplied to the radiator by a chiller, which can be adjacent to the heat sink or located remotely from the heat sink.
-
公开(公告)号：US11129296B2
公开(公告)日：2021-09-21
申请号：US16743958
申请日：2020-01-15
申请人： Quanta Computer Inc.
发明人： Chao-Jung Chen , Yu-Nien Huang , Tsung-Ta Li , Kuo-Wei Lee
摘要： A fan arrangement to generate increased airflow in a chassis is disclosed. The chassis includes one area having electronic components. A first row of fan modules is located in the chassis relative to the electronic components to generate airflow in a direction of the length of the chassis through the electronic components. The first row of fan modules includes at least one gap between the fan modules. A second row of fan modules is located a predetermined distance from the first row. The second row of fan modules includes at least one gap between the fan modules. Each of the fan modules in the second row is staggered from one of the fan modules of the first row. A first panel connects one of fan modules in the first row with one of the fan modules of the second row to create a channel.
-
公开(公告)号：US10989221B2
公开(公告)日：2021-04-27
申请号：US15197507
申请日：2016-06-29
申请人： Quanta Computer Inc.
发明人： Chao-Jung Chen , Yu-Nien Huang , Ching-Yu Chen , Tsung-Ta Li
摘要： A cooling system includes a fan and a system component. The fan includes a plurality of fan blades and configured to rotate in a fan direction. The system component is located downstream of the fan, and includes a cutout for passing of airflow from the fan, and a bridge spanning the cutout. The bridge includes a center section and at least one arm section extending from the center section to an edge of the cutout along a curved path offset towards the fan direction.
-
-
-
-
-
-
-
-
-
搜索结果
11 条记录 (耗时 0.013 秒)
