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公开(公告)号：US10856447B2
公开(公告)日：2020-12-01
申请号：US16246050
申请日：2019-01-11
申请人： QUANTA COMPUTER INC.
发明人： Chao-Jung Chen , Yu-Nien Huang , Ching-Yu Chen , Kuo-Wei Lee
摘要： A server includes an inner housing disposed within an outer housing such that a channel is defined between them. The inner housing includes a low-power electronic component and a high-power electronic component, and is sealed to protect the components. A first heat sink extends through the inner housing. Heat generated by the low-power electronic component is transferred through an inner portion of the first heat sink to an outer portion of the first heat sink. A second heat sink disposed in the channel is coupled to the high-power electronic component via heat pipes that extend through the inner housing. Heat generated by the high-power electronic component is transferred through the heat pipes to the second heat sink. A fan positioned in the channel causes air to enter the channel through a first vent, flow through the channel, and exit the channel via a second vent to remove the generated heat.
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公开(公告)号：US10453436B2
公开(公告)日：2019-10-22
申请号：US15401976
申请日：2017-01-09
申请人： QUANTA COMPUTER INC.
发明人： Chao-Jung Chen , Yu-Nien Huang , Ching-Yu Chen , Tsung-Ta Li
摘要： An anti-acoustics streamline apparatus is provided. The apparatus includes an air impedance wall having a front face, a rear face, and a plurality of openings extending from the front face to the rear face defining open areas; and a plurality of flow separating structures disposed adjacent to the front face, each of the plurality of flow separating structure extending vertically along the front face of the wall. The openings are configured to define first wall regions in the air impedance wall adjacent to each of the plurality of flow separating structures and second wall regions between the first wall regions. A first ratio of the open areas in the first wall regions to a total area in first wall regions is less than a second ratio of the open areas in the second wall regions to a total area in the second wall regions.
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公开(公告)号：US09915985B1
公开(公告)日：2018-03-13
申请号：US15397418
申请日：2017-01-03
申请人： QUANTA COMPUTER INC.
发明人： Chao-Jung Chen , Yu-Nien Huang , Ching-Yu Chen , Tsung-Ta Li
CPC分类号： G06F1/20 , H05K7/20145 , H05K7/20618 , H05K7/20727 , H05K7/20736
摘要： A computing system includes a chassis having an airflow entrance and an airflow exhaust, a duct structure disposed in the chassis, and a redirection mechanism located on a wall of the duct structure and extending through a cutout in the wall of the duct structure. In the computing system, the duct structure has a first end facing the airflow entrance and a second end facing the airflow exhaust. The redirection mechanism has a deflector having an inlet airfoil extending away from the duct structure towards the airflow entrance and at least one exhaust airfoil extending into the duct structure.
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公开(公告)号：US10694640B2
公开(公告)日：2020-06-23
申请号：US15985336
申请日：2018-05-21
申请人： QUANTA COMPUTER INC.
发明人： Chao-Jung Chen , Yu-Nien Huang , Ching-Yu Chen , Tsung-Ta Li
IPC分类号： H05K7/20
摘要： This disclosure relates to connecting a metal hose between a radiator and a cold plate that cools a CPU, or similar electronic heat generating component, whereby the metal hose is connected to the radiator with silicon casings. Waterproof spray plates are also provided to direct any water spray away from the electronic components. A water tray beneath the waterproof spray plates collects any water and directs it to a location outside the chassis.
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公开(公告)号：US10779439B2
公开(公告)日：2020-09-15
申请号：US16114962
申请日：2018-08-28
申请人： QUANTA COMPUTER INC.
发明人： Chao-Jung Chen , Yu-Nien Huang , Ching-Yu Chen , Erh-Kai Fang
IPC分类号： H05K7/20
摘要： An apparatus for cooling an electronic component is provided. The apparatus includes a heat-absorbing base configured to contact the electronic component within a server device and a heat-dissipating body connected to the heat-absorbing base. The heat-dissipating body includes a heat-dissipating static feature and at least one heat-dissipating dynamic feature. The at least one heat-dissipating dynamic feature is configured to be repositioned about the heat-dissipating static feature to increase a surface area of the heat-dissipating body. Using hinge device and flexible metal conduit connect and transfer heat to them (dynamic and static feature). This apparatus will follow currently assembly process and also not impact the other device assembly method. The more space we have inside the product the more heat we can solve.
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公开(公告)号：US10468010B2
公开(公告)日：2019-11-05
申请号：US15590673
申请日：2017-05-09
申请人： QUANTA COMPUTER INC.
发明人： Chao-Jung Chen , Yu-Nien Huang , Ching-Yu Chen , Liang-Yu Wu
IPC分类号： G10K11/22 , G11B33/08 , G11B33/12 , G11B33/14 , H05K7/20 , G10K11/16 , G10K11/18 , F16L55/033 , G10K11/178
摘要： An apparatus is provided. The apparatus includes a plurality of flow guiding structures spatially aligned in a first row, each of the plurality of flow guiding structures comprising a fin-shape to funnel airflow at a trailing edge of each of the plurality of flow guiding structures. The apparatus also includes a plurality of flow separating structures spatially aligned in a second row interleaved between each of the plurality of flow guiding structures, each of the plurality of flow separating structures comprising a fin-shape configured to split airflow received from the plurality of flow guiding structures.
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公开(公告)号：US10512193B1
公开(公告)日：2019-12-17
申请号：US16251776
申请日：2019-01-18
申请人： QUANTA COMPUTER INC.
发明人： Chao-Jung Chen , Yu-Nien Huang , Ching-Yu Chen , Tsung-Ta Li
摘要： The present disclosure describes a cooling chassis for a cooling system of a computer system. The cooling chassis includes a housing configured to allow air to pass through in a housing air flow direction. A first radiator is within the housing. The first radiator is oriented at a first oblique angle relative to the housing air flow direction. A first fan is configured to direct air through the first radiator in a first fan air flow direction oblique to the housing air flow direction.
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公开(公告)号：US10412851B2
公开(公告)日：2019-09-10
申请号：US15440999
申请日：2017-02-23
申请人： QUANTA COMPUTER INC.
发明人： Chao-Jung Chen , Yu-Nien Huang , Ching-Yu Chen , Chih-Wei Lin
摘要： A chassis is provided to improve the airflow over a plurality of disk drives. The chassis includes a housing with a front portion and a rear portion connected by a base portion. The base portion includes a plurality of hard drive slots oriented in a plurality of rows along a leading edge of the base portion. The chassis also includes a fan module configured to pass air from the front position of the housing to the rear position of the house. The plurality of hard drive slots is oriented such that a first portion of the hard drive slots is inclined relative to the leading edge of the base portion.
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公开(公告)号：US10989221B2
公开(公告)日：2021-04-27
申请号：US15197507
申请日：2016-06-29
申请人： Quanta Computer Inc.
发明人： Chao-Jung Chen , Yu-Nien Huang , Ching-Yu Chen , Tsung-Ta Li
摘要： A cooling system includes a fan and a system component. The fan includes a plurality of fan blades and configured to rotate in a fan direction. The system component is located downstream of the fan, and includes a cutout for passing of airflow from the fan, and a bridge spanning the cutout. The bridge includes a center section and at least one arm section extending from the center section to an edge of the cutout along a curved path offset towards the fan direction.
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公开(公告)号：US10782750B1
公开(公告)日：2020-09-22
申请号：US16392012
申请日：2019-04-23
申请人： QUANTA COMPUTER INC.
发明人： Chao-Jung Chen , Yu-Nien Huang , Ching-Yu Chen , Yu-Jou Ho
摘要： The present disclosure describes an intake system for a fan module within a computer system. The intake system includes a cowling positioned in line with an intake path of the fan module. The cowling is configured to direct air into the fan module. The system further includes a remote intake that has a remote inlet, a remote outlet, and a remote conduit. The remote inlet is configured to intake air from around an element that is within the computer system and outside of the intake path of the fan module. The remote outlet is configured to discharge the air from the remote inlet into the intake path of the fan module. The remote conduit is configured to transport the air from the remote inlet to the remote outlet.
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