- 专利标题: Silver paste, and conductive molded article obtained using same
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申请号: US15534385申请日: 2015-12-08
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公开(公告)号: US10696852B2公开(公告)日: 2020-06-30
- 发明人: Kaori Kawamura , Masayuki Moriwaki , Yoshiyuki Sano
- 申请人: DIC Corporation
- 申请人地址: JP Tokyo
- 专利权人: DIC CORPORATION
- 当前专利权人: DIC CORPORATION
- 当前专利权人地址: JP Tokyo
- 代理机构: McDermott Will & Emery LLP
- 优先权: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@64705958
- 国际申请: PCT/JP2015/084381 WO 20151208
- 国际公布: WO2016/093223 WO 20160616
- 主分类号: C09D5/24
- IPC分类号: C09D5/24 ; H01B1/22 ; C08L79/02 ; C09D7/61 ; B22F9/24 ; C09D179/02 ; C09D11/52 ; H01B5/14 ; C09D7/40 ; B22F9/20 ; C09D171/02 ; C09D163/00 ; H01B5/16 ; B22F1/00 ; C09D5/03 ; H05K1/09 ; C08G73/02 ; B05D1/00 ; B05D3/02 ; B82Y30/00 ; C08K3/08
摘要:
A problem is to provide a silver paste which can produce, without variation in resistivity value, a conductive silver coating film exhibiting resistivity substantially equivalent to the resistance value of bulk silver in low-temperature sintering. The problem is solved by providing a silver paste including a silver nanoparticle aqueous dispersion prepared by using a compound having a polyethyleneimine skeleton as a protective agent, a compound having a functional group reactable with nitrogen atoms in the polyethyleneimine, and at least one compound selected from the group consisting of a compound having an amine functional group and a compound having an amide functional group.
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