Invention Grant
- Patent Title: Sam assisted selective e-less plating on packaging materials
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Application No.: US15769699Application Date: 2016-08-08
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Publication No.: US10697065B2Publication Date: 2020-06-30
- Inventor: Fay Hua , Aranzazu Maestre Caro
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- International Application: PCT/US2016/046047 WO 20160808
- International Announcement: WO2017/095485 WO 20170608
- Main IPC: H05K3/46
- IPC: H05K3/46 ; C23C18/20 ; H01L21/48 ; C23C18/16

Abstract:
A method including activating an area of a polymer layer on a substrate with electromagnetic radiation; modifying the activated area; forming a self-assembled monolayer on the modified active area; reacting the self-assembled monolayer with the self-assembled monolayer; and reacting the self-assembled monolayer with a conductive material. A method including activating an area of a polymer dielectric layer on a substrate with electromagnetic radiation, the area selected for an electrically conductive line; modifying the activated area; forming a self-assembled monolayer on the modified active area; reacting the self-assembled monolayer with a catalyst; and electroless plating a conductive material on the self-assembled monolayer.
Public/Granted literature
- US20180305818A1 SAM ASSISTED SELECTIVE E-LESS PLATING ON PACKAGING MATERIALS Public/Granted day:2018-10-25
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