- 专利标题： Thin film capacitor and multilayer circuit board having the thin film capacitor embedded therein
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申请号： US16735386申请日： 2020-01-06
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公开(公告)号： US10699844B1公开(公告)日： 2020-06-30
- 发明人: Hitoshi Saita , Kazuhiro Yoshikawa , Yuuki Aburakawa , Tatsuo Namikawa , Akiyasu Iioka , Kenichi Yoshida
- 申请人： TDK CORPORATION
- 申请人地址： JP Tokyo
- 专利权人： TDK CORPORATION
- 当前专利权人： TDK CORPORATION
- 当前专利权人地址： JP Tokyo
- 代理机构： Young Law Firm, P.C.
- 优先权： com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@1c73ef84
- 主分类号： H01G4/33
- IPC分类号： H01G4/33 ; H05K1/02 ; H01G4/012 ; H05K1/16 ; H01L23/58 ; H01L23/498
摘要：
Disclosed herein is a thin film capacitor that includes a lower electrode layer, an upper electrode layer, and a dielectric layer positioned between the lower electrode layer and the upper electrode layer. The upper electrode layer has a first capacitive electrode part opposed to the lower electrode layer through the dielectric layer without being connected to the lower electrode layer and a fiducial mark part penetrating the dielectric layer to be connected to the lower electrode layer.
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