Invention Grant
- Patent Title: Electronic component
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Application No.: US15918188Application Date: 2018-03-12
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Publication No.: US10707020B2Publication Date: 2020-07-07
- Inventor: Shinya Onodera , Koki Ito , Hideki Kaneko
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2dabdb65
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/248 ; H01G4/232 ; H01G4/012 ; H01G4/12 ; H01G4/008
Abstract:
An electronic component includes an element body and an external electrode disposed on the element body. The external electrode includes a sintered metal layer and a conductive resin layer. The conductive resin layer is formed over the sintered metal layer and the element body. An average thickness of the conductive resin layer is smaller than that of the sintered metal layer.
Public/Granted literature
- US20180268998A1 ELECTRONIC COMPONENT Public/Granted day:2018-09-20
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