-
公开(公告)号：US11763996B2
公开(公告)日：2023-09-19
申请号：US17881204
申请日：2022-08-04
Applicant: TDK CORPORATION
Inventor： Shinya Onodera , Koki Ito , Hideki Kaneko
CPC classification number: H01G4/30 , H01G2/065 , H01G4/008 , H01G4/012 , H01G4/1218
Abstract: An element body includes a principal surface arranged to constitute a mounting surface and a first side surface adjacent to the principal surface. An external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the first side surface. The first electrode portion includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second electrode portion includes a first region and a second region. The first region includes a sintered metal layer and a plating layer formed on the sintered metal layer. The second region includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second region is located closer to the principal surface than the first region.
-
公开(公告)号：US11594378B2
公开(公告)日：2023-02-28
申请号：US17523524
申请日：2021-11-10
Applicant: TDK CORPORATION
Inventor： Shinya Onodera , Koki Ito , Hideki Kaneko
Abstract: An element body includes a principal surface arranged to constitute a mounting surface and a first side surface adjacent to the principal surface. An external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the first side surface. The first electrode portion includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second electrode portion includes a first region and a second region. The first region includes a sintered metal layer and a plating layer formed on the sintered metal layer. The second region includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second region is located closer to the principal surface than the first region.
-
Patent Agency Ranking
公开(公告)号：US11232910B2
公开(公告)日：2022-01-25
申请号：US16097175
申请日：2017-09-20
Applicant: TDK CORPORATION
Inventor： Shinya Onodera , Koki Ito , Hideki Kaneko
Abstract: An element body includes a principal surface arranged to constitute a mounting surface and a first side surface adjacent to the principal surface. An external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the first side surface. The first electrode portion includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second electrode portion includes a first region and a second region. The first region includes a sintered metal layer and a plating layer formed on the sintered metal layer. The second region includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second region is located closer to the principal surface than the first region.
-
公开(公告)号：US10755861B2
公开(公告)日：2020-08-25
申请号：US15695645
申请日：2017-09-05
Applicant: TDK CORPORATION
Inventor： Shinya Onodera , Koki Ito , Hideki Kaneko
Abstract: An electronic component includes an element body of a rectangular parallelepiped shape, an external electrode, and an insulating film. The element body includes a first principal surface as a mounting surface, and a first side surface adjacent to the first principal surface. The external electrode includes a first electrode part and a second electrode part. The first electrode part is disposed on the first principal surface. The second electrode part is disposed on the first side surface and connected to the first electrode part. The insulating film continuously covers an end edge of the first electrode part and at least a part of an end edge of the second electrode part.
-
公开(公告)号：US10707020B2
公开(公告)日：2020-07-07
申请号：US15918188
申请日：2018-03-12
Applicant: TDK CORPORATION
Inventor： Shinya Onodera , Koki Ito , Hideki Kaneko
Abstract: An electronic component includes an element body and an external electrode disposed on the element body. The external electrode includes a sintered metal layer and a conductive resin layer. The conductive resin layer is formed over the sintered metal layer and the element body. An average thickness of the conductive resin layer is smaller than that of the sintered metal layer.
-
公开(公告)号：US12142438B2
公开(公告)日：2024-11-12
申请号：US18230222
申请日：2023-08-04
Applicant: TDK CORPORATION
Inventor： Shinya Onodera , Koki Ito , Hideki Kaneko
Abstract: An element body includes a principal surface arranged to constitute a mounting surface and a first side surface adjacent to the principal surface. An external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the first side surface. The first electrode portion includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second electrode portion includes a first region and a second region. The first region includes a sintered metal layer and a plating layer formed on the sintered metal layer. The second region includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second region is located closer to the principal surface than the first region.
-
公开(公告)号：US11264172B2
公开(公告)日：2022-03-01
申请号：US16097175
申请日：2017-09-20
Applicant: TDK CORPORATION
Inventor： Shinya Onodera , Koki Ito , Hideki Kaneko
Abstract: An element body includes a principal surface arranged to constitute a mounting surface and a first side surface adjacent to the principal surface. An external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the first side surface. The first electrode portion includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second electrode portion includes a first region and a second region. The first region includes a sintered metal layer and a plating layer formed on the sintered metal layer. The second region includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second region is located closer to the principal surface than the first region.
-
-
-
-
-
-
Search Results
7
records
(took 0.01 seconds)
