-
公开(公告)号：US11763996B2
公开(公告)日：2023-09-19
申请号：US17881204
申请日：2022-08-04
Applicant: TDK CORPORATION
Inventor： Shinya Onodera , Koki Ito , Hideki Kaneko
CPC classification number: H01G4/30 , H01G2/065 , H01G4/008 , H01G4/012 , H01G4/1218
Abstract: An element body includes a principal surface arranged to constitute a mounting surface and a first side surface adjacent to the principal surface. An external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the first side surface. The first electrode portion includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second electrode portion includes a first region and a second region. The first region includes a sintered metal layer and a plating layer formed on the sintered metal layer. The second region includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second region is located closer to the principal surface than the first region.
-
公开(公告)号：US11594378B2
公开(公告)日：2023-02-28
申请号：US17523524
申请日：2021-11-10
Applicant: TDK CORPORATION
Inventor： Shinya Onodera , Koki Ito , Hideki Kaneko
Abstract: An element body includes a principal surface arranged to constitute a mounting surface and a first side surface adjacent to the principal surface. An external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the first side surface. The first electrode portion includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second electrode portion includes a first region and a second region. The first region includes a sintered metal layer and a plating layer formed on the sintered metal layer. The second region includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second region is located closer to the principal surface than the first region.
-
公开(公告)号：US10032559B2
公开(公告)日：2018-07-24
申请号：US15389181
申请日：2016-12-22
Applicant: TDK CORPORATION
Inventor： Norihisa Ando , Atsushi Takeda , Hideki Kaneko
Abstract: An electronic component is provided with an element body and terminal electrodes. The terminal electrodes include sintered metal layers and conductive resin layers. A first length, which is a length of the sintered metal layers in a first direction at end portions of a side surface in a second direction, is shorter than a second length, which is a length of the sintered metal layers in the first direction at central portions of the side surface in the second direction. A third length, which is a length of the conductive resin layers in the first direction at the end portions, is shorter than a fourth length, which is a length of the conductive resin layers in the first direction at the central portions. A difference between the fourth length and the third length is larger than a difference between the second length and the first length.
-
公开(公告)号：US10026556B2
公开(公告)日：2018-07-17
申请号：US15276172
申请日：2016-09-26
Applicant: TDK CORPORATION
Inventor： Norihisa Ando , Atsushi Takeda , Hideki Kaneko
Abstract: An electronic component includes an element body having a pair of end surfaces opposing each other and a side surface adjacent to the pair of end surfaces, and an external electrode disposed on at least the end surface. The external electrode includes a conductive resin layer located on at least the end surface. A first thickness of the conductive resin layer located on a central region of the end surface is greater than a second thickness of the conductive resin layer located on a peripheral region of the end surface.
-
公开(公告)号：US12278055B2
公开(公告)日：2025-04-15
申请号：US18154165
申请日：2023-01-13
Applicant: TDK CORPORATION
Inventor： Akihiro Masuda , Shinya Ito , Norihisa Ando , Hideki Kaneko , Ken Aburakawa , Kenya Tamaki , Akitoshi Yoshii
Abstract: An electronic component having a case including an accommodation part having an opening; a ceramic element in the accommodation part with first and second main faces facing each other, a first and second electrode formed to the first and second main face, respectively; a first metal terminal including a first electrode connecting part connecting to the first electrode, a first mounting part exposed out of the accommodation part through the opening, and a first terminal arm part connecting the first electrode connecting part and the first mounting part; a second metal terminal including a second electrode connecting part connecting to the second electrode, a second mounting part exposed out of the accommodation part through the opening, and a second terminal arm part connecting the second electrode connecting part and the second mounting part; and an insulation member between the first electrode and the second terminal arm part.
-
Patent Agency Ranking
公开(公告)号：US10707020B2
公开(公告)日：2020-07-07
申请号：US15918188
申请日：2018-03-12
Applicant: TDK CORPORATION
Inventor： Shinya Onodera , Koki Ito , Hideki Kaneko
Abstract: An electronic component includes an element body and an external electrode disposed on the element body. The external electrode includes a sintered metal layer and a conductive resin layer. The conductive resin layer is formed over the sintered metal layer and the element body. An average thickness of the conductive resin layer is smaller than that of the sintered metal layer.
-
公开(公告)号：US12142438B2
公开(公告)日：2024-11-12
申请号：US18230222
申请日：2023-08-04
Applicant: TDK CORPORATION
Inventor： Shinya Onodera , Koki Ito , Hideki Kaneko
Abstract: An element body includes a principal surface arranged to constitute a mounting surface and a first side surface adjacent to the principal surface. An external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the first side surface. The first electrode portion includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second electrode portion includes a first region and a second region. The first region includes a sintered metal layer and a plating layer formed on the sintered metal layer. The second region includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second region is located closer to the principal surface than the first region.
-
公开(公告)号：US20230268128A1
公开(公告)日：2023-08-24
申请号：US18154165
申请日：2023-01-13
Applicant: TDK CORPORATION
Inventor： Akihiro MASUDA , Shinya ITO , Norihisa Ando , Hideki Kaneko , Ken Aburakawa , Kenya Tamaki , Akitoshi Yoshii
Abstract: An electronic component having a case including an accommodation part having an opening; a ceramic element in the accommodation part with first and second main faces facing each other, a first and second electrode formed to the first and second main face, respectively; a first metal terminal including a first electrode connecting part connecting to the first electrode, a first mounting part exposed out of the accommodation part through the opening, and a first terminal arm part connecting the first electrode connecting part and the first mounting part; a second metal terminal including a second electrode connecting part connecting to the second electrode, a second mounting part exposed out of the accommodation part through the opening, and a second terminal arm part connecting the second electrode connecting part and the second mounting part; and an insulation member between the first electrode and the second terminal arm part.
-
公开(公告)号：US11264172B2
公开(公告)日：2022-03-01
申请号：US16097175
申请日：2017-09-20
Applicant: TDK CORPORATION
Inventor： Shinya Onodera , Koki Ito , Hideki Kaneko
Abstract: An element body includes a principal surface arranged to constitute a mounting surface and a first side surface adjacent to the principal surface. An external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the first side surface. The first electrode portion includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second electrode portion includes a first region and a second region. The first region includes a sintered metal layer and a plating layer formed on the sintered metal layer. The second region includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second region is located closer to the principal surface than the first region.
-
公开(公告)号：US09892855B2
公开(公告)日：2018-02-13
申请号：US15275953
申请日：2016-09-26
Applicant: TDK CORPORATION
Inventor： Norihisa Ando , Atsushi Takeda , Hideki Kaneko , Yui Sugiura , Tatsuo Inagaki , Tomomichi Gunji , Kouhei Yamaguchi
Abstract: An external electrode includes a sintered metal layer disposed on at least an end surface and a conductive resin layer disposed on the sintered metal layer. The sintered metal layer includes a first portion, a second portion, and a third portion. The first portion is disposed at a central region of the end surface. The second portion is disposed at a part of a peripheral region of the end surface, and extends to an edge portion of the end surface from the first portion. The third portion is disposed at a remaining part of the peripheral region of the end surface. The thickness of the second portion is less than that of the first portion. The thickness of the third portion is less than that of the second portion. The first portion, the second portion, and the third portion are covered with the conductive resin layer.
-
-
-
-
-
-
-
-
-
Search Results
14
records
(took 0.015 seconds)
