Invention Grant
- Patent Title: Electronic components
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Application No.: US16526082Application Date: 2019-07-30
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Publication No.: US10707023B2Publication Date: 2020-07-07
- Inventor: Ho Yoon Kim , Jae Yeol Choi , Soo Hwan Son
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Morgan, Lewis & Bockius LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@4eebed1
- Main IPC: H01G4/232
- IPC: H01G4/232 ; H01G4/30 ; H01G4/38 ; H05K1/11 ; H05K1/18 ; H01G4/248

Abstract:
An electronic component includes: a plurality of multilayer capacitors stacked in multiple rows and columns and each having external electrodes on both ends thereof in a first direction; and a board including a body and a connection portion. The connection portion includes: a plurality of positive electrode land patterns; a plurality of negative electrode land patterns; positive and negative electrode terminal patterns formed on a lower surface of the body to be spaced apart from each other in the first direction; a positive electrode connection portion connecting the plurality of positive electrode land patterns to the positive electrode terminal pattern; and a negative electrode connection portion connecting the plurality of negative electrode land patterns to the negative electrode terminal pattern.
Public/Granted literature
- US20190355525A1 ELECTRONIC COMPONENTS Public/Granted day:2019-11-21
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