Invention Grant
- Patent Title: Package with vertical interconnect between carrier and clip
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Application No.: US15497267Application Date: 2017-04-26
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Publication No.: US10707158B2Publication Date: 2020-07-07
- Inventor: Alexander Heinrich , Bernd Goller , Thorsten Meyer , Gerald Ofner
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@1568ab19
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L23/00 ; H01L23/495 ; H01L21/48 ; H01L21/56 ; H01L23/31
Abstract:
A package comprising a chip carrier, an electronic chip on the chip carrier, a clip on the electronic chip, an encapsulant at least partially encapsulating the electronic chip, and an electrically conductive vertical connection structure provided separately from the clip and electrically connecting the chip carrier with the clip.
Public/Granted literature
- US20170317016A1 Package with vertical interconnect between carrier and clip Public/Granted day:2017-11-02
Information query
IPC分类:
