- 专利标题: Modified polyvinyl acetal resin composition
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申请号: US15743390申请日: 2016-09-30
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公开(公告)号: US10711128B2公开(公告)日: 2020-07-14
- 发明人: Takayuki Maeda , Kenji Yamauchi , Shiori Tateno
- 申请人: SEKISUI CHEMICAL CO., LTD.
- 申请人地址: JP Osaka
- 专利权人: SEKISUI CHEMICAL CO., LTD.
- 当前专利权人: SEKISUI CHEMICAL CO., LTD.
- 当前专利权人地址: JP Osaka
- 代理机构: Wenderoth, Lind & Ponack, L.L.P.
- 优先权: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@68bfe44c
- 国际申请: PCT/JP2016/078985 WO 20160930
- 国际公布: WO2017/057663 WO 20170406
- 主分类号: C08L29/14
- IPC分类号: C08L29/14 ; C08F8/28 ; C08L63/00 ; C09J129/04 ; C09J129/14 ; C09J163/00 ; C08L29/04 ; C08F8/06 ; C08F16/28 ; C08F216/38
摘要:
The present invention aims to provide a modified polyvinyl acetal resin composition that is excellent in storage stability, has high strength and excellent adhesiveness, and is capable of reducing occurrence of warping or peeling when used for bonding different materials. The present invention relates to a modified polyvinyl acetal resin composition containing: a modified polyvinyl acetal resin having a constitutional unit with an imine structure, and an epoxy resin.
公开/授权文献
- US20180194935A1 MODIFIED POLYVINYL ACETAL RESIN COMPOSITION 公开/授权日:2018-07-12