公开(公告)号：US10711128B2

公开(公告)日：2020-07-14

申请号：US15743390

申请日：2016-09-30

申请人： SEKISUI CHEMICAL CO., LTD.

发明人： Takayuki Maeda ,  Kenji Yamauchi ,  Shiori Tateno

IPC分类号： C08L29/14 ,  C08F8/28 ,  C08L63/00 ,  C09J129/04 ,  C09J129/14 ,  C09J163/00 ,  C08L29/04 ,  C08F8/06 ,  C08F16/28 ,  C08F216/38

摘要： The present invention aims to provide a modified polyvinyl acetal resin composition that is excellent in storage stability, has high strength and excellent adhesiveness, and is capable of reducing occurrence of warping or peeling when used for bonding different materials. The present invention relates to a modified polyvinyl acetal resin composition containing: a modified polyvinyl acetal resin having a constitutional unit with an imine structure, and an epoxy resin.

公开(公告)号：US10968373B2

公开(公告)日：2021-04-06

申请号：US16334814

申请日：2017-09-26

申请人： SEKISUI CHEMICAL CO., LTD.

发明人： Shiori Tateno ,  Takayuki Maeda ,  Kenji Yamauchi

IPC分类号： C09J163/00 ,  C08L31/04 ,  C08F8/28 ,  C09J129/14

摘要： The present invention provides an epoxy adhesive composition that is excellent in compatibility and storage stability, has high strength and excellent adhesiveness, is capable of reducing occurrence of warping or peeling when used for bonding different materials, and is also excellent in impact resistance after being cured. Provided is an epoxy adhesive composition including: a modified polyvinyl acetal resin having a constitutional unit with an acid-modified group; and an epoxy resin, the epoxy adhesive composition containing an organic solvent in an amount of 10.0% by weight or less.

公开(公告)号：US09951154B2

公开(公告)日：2018-04-24

申请号：US15124103

申请日：2014-03-24

申请人： SEKISUI CHEMICAL CO., LTD.

发明人： Kenji Yamauchi ,  Jiro Miyai ,  Shogo Naruwaki ,  Takayuki Maeda

IPC分类号： G03C1/498 ,  C08F8/28 ,  C09D129/14 ,  C09D5/26 ,  C09D5/32

CPC分类号： C08F8/28 ,  C08F2800/10 ,  C08L2205/025 ,  C09D5/26 ,  C09D5/32 ,  C09D129/14 ,  G03C1/49863 ,  C08K13/02 ,  C08F16/06

摘要： A polyvinyl acetal resin for a heat-developable photosensitive material capable of preventing skinning in the coating process of the photosensitive layer of the heat-developable photosensitive material, preventing deterioration of image characteristics and coloration of the coating solution, and suppressing the occurrence of odor at the time of producing the heat-developable photosensitive material and heat development.The polyvinyl acetal resin for a heat-developable photosensitive material used for a photosensitive layer of the heat-developable photosensitive material has a residual acetyl group content of 25 mol % or less, residual hydroxyl group content of 17-35 mol %, and polymerization degree of 200 to 3,000, and is obtained by an acetalization of a polyvinyl alcohol mixture containing polyvinyl alcohol resins having different polymerization degrees, wherein the content of the polyvinyl alcohol having a polymerization degree of 600 or less is 50 wt % or higher in the polyvinyl alcohol mixture.