- 专利标题： Wireless charging package with chip integrated in coil center
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申请号： US16192005申请日： 2018-11-15
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公开(公告)号： US10720388B2公开(公告)日： 2020-07-21
- 发明人: Chen-Hua Yu , Chiang-Jui Chu , Chung-Shi Liu , Hao-Yi Tsai , Ming Hung Tseng , Hung-Yi Kuo
- 申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Slater Matsil, LLP
- 主分类号： H01L29/00
- IPC分类号： H01L29/00 ; H01L23/522 ; H01L23/31 ; H01L25/065 ; H01L25/00 ; H01L49/02 ; H01L21/48 ; H01L21/56 ; H01L23/48 ; H01L23/498 ; H01L23/538 ; H01L23/00 ; H01L25/16 ; H01L21/683
摘要：
A package includes a device die, and an encapsulating material encapsulating the device die therein. The encapsulating material has a top surface coplanar with a top surface of the device die. A coil extends from the top surface to a bottom surface of the encapsulating material, and the device die is in the region encircled by the coil. At least one dielectric layer is formed over the encapsulating material and the coil. A plurality of redistribution lines is in the at least one dielectric layer. The coil is electrically coupled to the device die through the plurality of redistribution lines.
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