Invention Grant
- Patent Title: Processor monitoring of thermal degradation
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Application No.: US15329200Application Date: 2014-07-29
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Publication No.: US10725509B2Publication Date: 2020-07-28
- Inventor: Chin-Yu Wang , Sheng-Lung Liao
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: Brooks Cameron & Huebsch PLLC
- International Application: PCT/US2014/048595 WO 20140729
- International Announcement: WO2016/018249 WO 20160204
- Main IPC: G06F1/20
- IPC: G06F1/20 ; G06F9/4401 ; G06F11/07 ; G06F11/30 ; G06F11/34

Abstract:
A method includes executing an initialization routine upon startup of a processor. The method includes executing a benchmark program during the initialization routine after the startup. The method further includes comparing an amount of time for execution of the benchmark program to a reference time to determine if the processor has slowed due to thermal degradation of heat removal components for the processor.
Public/Granted literature
- US20170212562A1 PROCESSOR MONITORING OF THERMAL DEGRADATION Public/Granted day:2017-07-27
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