Invention Grant
- Patent Title: Composition for bonding
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Application No.: US15951424Application Date: 2018-04-12
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Publication No.: US10731233B2Publication Date: 2020-08-04
- Inventor: Minoru Yamada , Atsushi Yamada , Koichi Shibuya , Shinya Kikugawa , Keisuke Hanashima
- Applicant: AGC Inc.
- Applicant Address: JP Chiyoda-ku
- Assignee: AGC Inc.
- Current Assignee: AGC Inc.
- Current Assignee Address: JP Chiyoda-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@e6f65b
- Main IPC: C22C13/00
- IPC: C22C13/00 ; B23K35/26 ; C03C27/08
Abstract:
A composition for bonding includes tin, germanium, and nickel. A contained amount of germanium is less than or equal to 10 mass %. A contained amount of nickel in mass % is less than or equal to a product of 2.8 multiplied by a term that is the contained amount of germanium in mass % to the power of 0.3.
Public/Granted literature
- US20180230575A1 COMPOSITION FOR BONDING Public/Granted day:2018-08-16
Information query
