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公开(公告)号：US10731233B2
公开(公告)日：2020-08-04
申请号：US15951424
申请日：2018-04-12
Applicant: AGC Inc.
Inventor： Minoru Yamada , Atsushi Yamada , Koichi Shibuya , Shinya Kikugawa , Keisuke Hanashima
Abstract: A composition for bonding includes tin, germanium, and nickel. A contained amount of germanium is less than or equal to 10 mass %. A contained amount of nickel in mass % is less than or equal to a product of 2.8 multiplied by a term that is the contained amount of germanium in mass % to the power of 0.3.
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