Invention Grant
- Patent Title: Connecting apparatus and system
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Application No.: US14670821Application Date: 2015-03-27
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Publication No.: US10740271B2Publication Date: 2020-08-11
- Inventor: Chongyang Wang , Jun Zhang
- Applicant: Huawei Technologies Co., Ltd.
- Applicant Address: CN Shenzhen
- Assignee: Huawei Technologies Co., Ltd.
- Current Assignee: Huawei Technologies Co., Ltd.
- Current Assignee Address: CN Shenzhen
- Agency: Slater Matsil, LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@1b50e913
- Main IPC: G06F13/40
- IPC: G06F13/40 ; H04L12/931 ; G06F13/42

Abstract:
Embodiments of the present invention provide a connecting apparatus and a system. The connecting apparatus includes N interconnection units, M line processing units, and X switch processing units, where each interconnection unit is connected to at least one switch processing unit, each switch processing unit is connected to only one interconnection unit, each interconnection unit is connected to the M line processing units, each line processing unit is connected to the N interconnection units, M is a positive integer, N is a positive integer, and X is greater than or equal to N. In addition, the embodiments of the present invention further provide another connecting apparatus and system. According to the foregoing technical solutions, a connecting mode between an LPU and an SPU is relatively flexible.
Public/Granted literature
- US20150212963A1 Connecting Apparatus and System Public/Granted day:2015-07-30
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