发明授权
- 专利标题: Oxygen inserted Si-layers for reduced substrate dopant outdiffusion in power devices
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申请号: US16058593申请日: 2018-08-08
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公开(公告)号: US10741638B2公开(公告)日: 2020-08-11
- 发明人: Martin Poelzl , Robert Haase , Maximilian Roesch , Sylvain Leomant , Andreas Meiser , Bernhard Goller , Ravi Keshav Joshi
- 申请人: Infineon Technologies Austria AG
- 申请人地址: AT Villach
- 专利权人: Infineon Technologies Austria AG
- 当前专利权人: Infineon Technologies Austria AG
- 当前专利权人地址: AT Villach
- 代理机构: Murphy, Bilak & Homiller, PLLC
- 主分类号: H01L29/06
- IPC分类号: H01L29/06 ; H01L29/78 ; H01L29/417 ; H01L27/06 ; H01L21/225 ; H01L29/40 ; H01L29/66 ; H01L21/02 ; H01L29/10 ; H01L29/739
摘要:
A semiconductor device includes a doped Si base substrate, one or more device epitaxial layers formed over a main surface of the doped Si base substrate, a diffusion barrier structure, and a gate formed above the diffusion barrier structure. The diffusion barrier structure includes alternating layers of Si and oxygen-doped Si formed in an upper part of the doped Si base substrate adjacent the main surface of the doped Si base substrate, in a lower part of the one or more device epitaxial layers adjacent the main surface of the doped Si base substrate, or in one or more additional epitaxial layers disposed between the main surface of the doped Si base substrate and the one or more device epitaxial layers.
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