Invention Grant
- Patent Title: Semiconductor device
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Application No.: US16200730Application Date: 2018-11-27
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Publication No.: US10741659B2Publication Date: 2020-08-11
- Inventor: Chang Seop Yoon , Byoung Wook Jeong
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@541f65bb
- Main IPC: H01L29/423
- IPC: H01L29/423 ; H01L27/088

Abstract:
A semiconductor device comprising a first field insulating film around at least a part of a first fin type pattern and at least a part of a second fin type pattern, a second field insulating film between the first fin type pattern and the second fin type pattern and protruding from the first field insulating film and a first gate structure which extends over the first and second field insulating films in a second direction intersecting with a first direction, and includes a first portion on the first field insulating film, and a second portion on the second field insulating film, wherein a first width of the first portion of the first gate structure is greater than a second width of the second portion of the first gate structure.
Public/Granted literature
- US20190326407A1 SEMICONDUCTOR DEVICE Public/Granted day:2019-10-24
Information query
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