- 专利标题： Methods and apparatus for measuring a property of a substrate
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申请号： US16380223申请日： 2019-04-10
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公开(公告)号： US10746668B2公开(公告)日： 2020-08-18
- 发明人: Wouter Lodewijk Elings , Franciscus Bernardus Maria Van Bilsen , Christianus Gerardus Maria De Mol , Everhardus Cornelis Mos , Hoite Pieter Theodoor Tolsma , Peter Ten Berge , Paul Jacques Van Wijnen , Leonardus Henricus Marie Verstappen , Gerald Dicker , Reiner Maria Jungblut , Chung-Hsun Li
- 申请人： ASML Netherlands B.V.
- 申请人地址： NL Veldhoven
- 专利权人： ASML Netherlands B.V.
- 当前专利权人： ASML Netherlands B.V.
- 当前专利权人地址： NL Veldhoven
- 代理机构： Sterne, Kessler, Goldstein & Fox P.L.L.C.
- 主分类号： G01N21/95
- IPC分类号： G01N21/95 ; G01B11/14 ; G01B11/02 ; G01N21/956 ; G03F7/20 ; H01L21/66 ; G05B19/418 ; G01B11/00 ; G01B11/26
摘要：
In the measurement of properties of a wafer substrate, such as Critical Dimension or overlay a sampling plan is produced 2506 defined for measuring a property of a substrate, wherein the sampling plan comprises a plurality of sub-sampling plans. The sampling plan may be constrained to a predetermined fixed number of measurement points and is used 2508 to control an inspection apparatus to perform a plurality of measurements of the property of a plurality of substrates using different sub-sampling plans for respective substrates, optionally, the results are stacked 2510 to at least partially recompose the measurement results according to the sample plan.
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