Invention Grant
- Patent Title: Metal smart card with dual interface capability
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Application No.: US16739211Application Date: 2020-01-10
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Publication No.: US10748049B2Publication Date: 2020-08-18
- Inventor: John Herslow , Adam Lowe , Luis Dasilva , Brian Nester
- Applicant: CompoSecure, LLC
- Applicant Address: US NJ Somerset
- Assignee: Composecure, LLC
- Current Assignee: Composecure, LLC
- Current Assignee Address: US NJ Somerset
- Agency: RatnerPrestia
- Main IPC: G06K19/077
- IPC: G06K19/077 ; G06K19/07
Abstract:
A smart card having a metal layer, an opening in the metal layer and a dual interface integrated circuit (IC) module and a plug non-RF-impeding material mounted in the opening, with at least one at least one additional layer stacked relative to the plug.
Public/Granted literature
- US20200151535A1 METAL SMART CARD WITH DUAL INTERFACE CAPABILITY Public/Granted day:2020-05-14
Information query
