公开(公告)号：US10748049B2

公开(公告)日：2020-08-18

申请号：US16739211

申请日：2020-01-10

Applicant: CompoSecure, LLC

Inventor： John Herslow ,  Adam Lowe ,  Luis Dasilva ,  Brian Nester

IPC: G06K19/077 ,  G06K19/07

Abstract: A smart card having a metal layer, an opening in the metal layer and a dual interface integrated circuit (IC) module and a plug non-RF-impeding material mounted in the opening, with at least one at least one additional layer stacked relative to the plug.

公开(公告)号：US10318859B2

公开(公告)日：2019-06-11

申请号：US15976612

申请日：2018-05-10

Applicant: COMPOSECURE, LLC

Inventor： Adam Lowe ,  John Herslow ,  Luis Dasilva ,  Brian Nester

IPC: H01Q1/22 ,  G06K19/077 ,  H01L23/66 ,  H01Q1/38

Abstract: A card having a metal layer and an opening or cut-out region in the metal layer, with a dual-interface integrated circuit (IC) module disposed in the opening or cut-out region. A ferrite layer is disposed below the metal layer and a booster antenna is attached to the ferrite layer. A vertical hole extends beneath the IC module through the ferrite layer. The booster antenna may be physically connected to the IC module or may be configured to inductively couple to the IC module. In some embodiments, the IC may be disposed in or on a non-conductive plug disposed within the opening or cut-out region, or the vertical hole may have a non-conductive lining, or a connector may be disposed between the booster antenna and the IC module in the vertical hole.

公开(公告)号：US10289944B2

公开(公告)日：2019-05-14

申请号：US15742813

申请日：2015-07-08

Applicant: CompoSecure, LLC

Inventor： John Herslow ,  Adam Lowe ,  Luis Dasilva ,  Brian Nester

IPC: G06K19/07 ,  G06K19/077

Abstract: A dual interface smart card having a metal layer includes an SC module, with contacts and RF capability, mounted on a plug, formed of non RF impeding material, between the top and bottom surfaces of the metal layer. The plug provides support for the IC module and a degree of electrical insulation and isolation from the metal layer. The resultant card can have contact and contactless operating capability and an entirely smooth external metal surface except for the contacts of the IC module.

公开(公告)号：US20190220723A1

公开(公告)日：2019-07-18

申请号：US16367595

申请日：2019-03-28

Applicant: CompoSecure, LLC

Inventor： John Herslow ,  Adam Lowe ,  Luis Dasilva ,  Brian Nester

IPC: G06K19/077 ,  G06K19/07

CPC classification number: G06K19/07722 ,  G06K19/0723 ,  G06K19/07769 ,  G06K19/07771 ,  G06K19/07773

Abstract: A dual interface smart card, and methods for the manufacture thereof, having a metal layer, an IC module, with contacts and RF capability, and a plug formed of non RF impeding material, disposed in the metal layer. The plug provides support for the IC module and a degree of electrical insulation and isolation from the metal layer. Embodiments of the card include at least one additional layer.

公开(公告)号：US11301744B2

公开(公告)日：2022-04-12

申请号：US16935948

申请日：2020-07-22

Applicant: CompoSecure, LLC

Inventor： John Herslow ,  Adam Lowe ,  Luis Dasilva ,  Brian Nester

IPC: G06K19/077 ,  H01L23/66 ,  H01Q1/38 ,  H01Q1/22

Abstract: A transaction card comprising a metal layer. A first cut out region in a first surface of said metal layer has a depth less than the thickness of the metal layer, and a first portion of an integrated circuit (IC) module is secured therein. A second cut out region extends from the first cut out region to the second surface of said metal layer and defines a non-RF-impeding volume having a perimeter greater than the perimeter of the first cut out region. One or more additional layers are stacked on the second surface of the metal layer, and a channel extends between one of the stacked layers and the IC module.

公开(公告)号：US20200151535A1

公开(公告)日：2020-05-14

申请号：US16739211

申请日：2020-01-10

Applicant: CompoSecure, LLC

Inventor： John Herslow ,  Adam Lowe ,  Luis Dasilva ,  Brian Nester

IPC: G06K19/077 ,  G06K19/07

Abstract: A smart card having a metal layer, an opening in the metal layer and a dual interface integrated circuit (IC) module and a plug non-RF-impeding material mounted in the opening, with at least one at least one additional layer stacked relative to the plug.

公开(公告)号：US10534990B2

公开(公告)日：2020-01-14

申请号：US16367595

申请日：2019-03-28

Applicant: CompoSecure, LLC

Inventor： John Herslow ,  Adam Lowe ,  Luis Dasilva ,  Brian Nester

IPC: G06K19/077 ,  G06K19/07

Abstract: A dual interface smart card, and methods for the manufacture thereof, having a metal layer, an IC module, with contacts and RF capability, and a plug formed of non RF impeding material, disposed in the metal layer. The plug provides support for the IC module and a degree of electrical insulation and isolation from the metal layer. Embodiments of the card include at least one additional layer.