Invention Grant
- Patent Title: Substrate processing method and substrate processing apparatus
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Application No.: US15699196Application Date: 2017-09-08
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Publication No.: US10748795B2Publication Date: 2020-08-18
- Inventor: Kota Sotoku , Toyohide Hayashi , Akito Hatano , Takayuki Gohara , Hiroaki Takahashi
- Applicant: SCREEN Holdings Co., Ltd.
- Applicant Address: JP
- Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee Address: JP
- Agency: Ostrolenk Faber LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@49565e59
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/677 ; H01L21/687
Abstract:
A substrate processing apparatus including a plurality of baking chambers stacked in a prescribed direction, each baking chamber carrying out heat treatment of a substrate in its interior, a processing unit having a liquid processing chamber separate from the baking chambers and carrying out liquid processing of the substrate using the processing liquid, and an enclosing isolating space that encloses the sides of the plurality of baking chambers and isolates the baking chambers from the surrounding area.
Public/Granted literature
- US20180090352A1 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS Public/Granted day:2018-03-29
Information query
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