Invention Grant
- Patent Title: Thin chassis near field communication (NFC) antenna integration
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Application No.: US15607378Application Date: 2017-05-26
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Publication No.: US10749261B2Publication Date: 2020-08-18
- Inventor: Songnan Yang , Hao-Han Hsu , Ulun Karacaoglu , Anand S. Konanur , Yee Wei Eric Hong
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schiff Hardin LLP
- Main IPC: H04B5/00
- IPC: H04B5/00 ; H01Q7/00 ; H01Q1/22 ; H04W4/80 ; H01Q1/44 ; H01Q1/24

Abstract:
Described herein are techniques related one or more systems, apparatuses, methods, etc. for integrating a near field communications (NFC) coil antenna in a portable device. For example, the NFC antenna is integrated under a metal chassis of the portable device. The metal chassis and a conductive coating—that is integrated underneath the full metal chassis—are designed to include one or more slots to provide high impedance to Eddy current induced in the conductive coating.
Public/Granted literature
- US20170264342A1 THIN CHASSIS NEAR FIELD COMMUNICATION (NFC) ANTENNA INTEGRATION Public/Granted day:2017-09-14
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