Invention Grant
- Patent Title: MEMS microphone chip and MEMS microphone
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Application No.: US16465756Application Date: 2017-03-03
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Publication No.: US10750292B2Publication Date: 2020-08-18
- Inventor: Junkai Zhan , Jianglong Li , Mengjin Cai
- Applicant: GOERTEK, INC.
- Applicant Address: CN Weifang, Shandong
- Assignee: Goertek, Inc.
- Current Assignee: Goertek, Inc.
- Current Assignee Address: CN Weifang, Shandong
- Agency: Baker Botts, L.L.P.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@b9effb7
- International Application: PCT/CN2017/075594 WO 20170303
- International Announcement: WO2018/103208 WO 20180614
- Main IPC: H04R19/04
- IPC: H04R19/04 ; B81B7/00 ; H04R1/04 ; H04R19/00

Abstract:
Provided are a MEMS microphone chip and an MEMS microphone. The MEMS microphone chip comprises a substrate, a backplate and a vibration diaphragm, the backplate and the vibration diaphragm constituting two electrodes of a capacitor respectively, the backplate and the vibration diaphragm being suspended above the substrate, the backplate being located between the substrate and the vibration diaphragm, and the substrate being provided with a back chamber and a support column, the support column being connected to a side wall of the back chamber via a connection portion, a through hole or a notch being formed in the connection portion through its thickness direction, to allow spaces at opposite sides of the connection portion to communicate with each other; and the support column being configured to support the backplate.
Public/Granted literature
- US20190394574A1 MEMS MICROPHONE CHIP AND MEMS MICROPHONE Public/Granted day:2019-12-26
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