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公开(公告)号：US10750292B2
公开(公告)日：2020-08-18
申请号：US16465756
申请日：2017-03-03
申请人： GOERTEK, INC.
发明人： Junkai Zhan , Jianglong Li , Mengjin Cai
摘要： Provided are a MEMS microphone chip and an MEMS microphone. The MEMS microphone chip comprises a substrate, a backplate and a vibration diaphragm, the backplate and the vibration diaphragm constituting two electrodes of a capacitor respectively, the backplate and the vibration diaphragm being suspended above the substrate, the backplate being located between the substrate and the vibration diaphragm, and the substrate being provided with a back chamber and a support column, the support column being connected to a side wall of the back chamber via a connection portion, a through hole or a notch being formed in the connection portion through its thickness direction, to allow spaces at opposite sides of the connection portion to communicate with each other; and the support column being configured to support the backplate.
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公开(公告)号：US20190394574A1
公开(公告)日：2019-12-26
申请号：US16465756
申请日：2017-03-03
申请人： GOERTEK, INC.
发明人： JUNKAI ZHAN , Jianglong Li , Mengjin Cai
摘要： Provided are a MEMS microphone chip and an MEMS microphone. The MEMS microphone chip comprises a substrate, a backplate and a vibration diaphragm, the backplate and the vibration diaphragm constituting two electrodes of a capacitor respectively, the backplate and the vibration diaphragm being suspended above the substrate, the backplate being located between the substrate and the vibration diaphragm, and the substrate being provided with a back chamber and a support column, the support column being connected to a side wall of the back chamber via a connection portion, a through hole or a notch being formed in the connection portion through its thickness direction, to allow spaces at opposite sides of the connection portion to communicate with each other; and the support column being configured to support the backplate.
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