Invention Grant
- Patent Title: Laser cutting apparatus and laser cutting method using the same
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Application No.: US15814231Application Date: 2017-11-15
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Publication No.: US10751838B2Publication Date: 2020-08-25
- Inventor: Ilyoung Jeong , Gyoowan Han , Jaeil Kim , Kuhyun Kang , Soobum Park
- Applicant: Samsung Display Co., Ltd.
- Applicant Address: KR Yongin-si
- Assignee: Samsung Display Co., Ltd.
- Current Assignee: Samsung Display Co., Ltd.
- Current Assignee Address: KR Yongin-si
- Agency: Lewis Roca Rothgerber Christie LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@671ee302
- Main IPC: B23K26/38
- IPC: B23K26/38 ; B23K26/082 ; B23K26/03 ; B23K26/08 ; B23K26/402 ; C03B33/04 ; C03B33/09 ; B23K26/0622 ; B23K26/04 ; B23K103/00

Abstract:
A laser cutting apparatus and a laser cutting method are provided. A laser cutting method includes: preparing an object on a stage; cutting the object into a set shape by relatively moving and irradiating a laser beam along the set shape with respect to the object; and performing uniform heating compensation to reduce accumulation of thermal energy of the laser beam resulting from a change of speed at a shift point where a travelling direction of the laser beam with respect to the object changes.
Public/Granted literature
- US20180133842A1 LASER CUTTING APPARATUS AND LASER CUTTING METHOD USING THE SAME Public/Granted day:2018-05-17
Information query
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