公开(公告)号：US20230232696A1

公开(公告)日：2023-07-20

申请号：US18191135

申请日：2023-03-28

Applicant: Samsung Display Co., Ltd.

Inventor： GEUNWOO YUG ,  Myeongseok Jeong ,  Soobum Park ,  Junghwa You ,  Ilyoung Jeong

IPC: H10K71/00 ,  H10K50/86 ,  H10K59/12 ,  H10K59/40 ,  H10K71/80 ,  H10K77/10

CPC classification number: H10K71/00 ,  H10K50/86 ,  H10K59/12 ,  H10K59/40 ,  H10K71/80 ,  H10K77/111 ,  H10K59/1201 ,  H10K71/851 ,  H10K2102/311

Abstract: A method of manufacturing a display apparatus includes separating a mother substrate that includes a plurality of connected unit display apparatuses into a plurality of separated unit display apparatuses. Each separated unit display apparatus includes a display panel and at least one supporting unit attached below the display panel. The display panel includes a display substrate that has a pad area on which are disposed a plurality of pads and a thin film encapsulation layer on the display substrate. The method further includes consecutively cutting the display panel and the at least one supporting unit of each separated unit display apparatus along cutting lines in the pad area, where a first cut surface of the pad area of the display substrate and a second cut surface of the at least one supporting unit are respectively cut at different angles.

公开(公告)号：US10751838B2

公开(公告)日：2020-08-25

申请号：US15814231

申请日：2017-11-15

Applicant: Samsung Display Co., Ltd.

Inventor： Ilyoung Jeong ,  Gyoowan Han ,  Jaeil Kim ,  Kuhyun Kang ,  Soobum Park

IPC: B23K26/38 ,  B23K26/082 ,  B23K26/03 ,  B23K26/08 ,  B23K26/402 ,  C03B33/04 ,  C03B33/09 ,  B23K26/0622 ,  B23K26/04 ,  B23K103/00

Abstract: A laser cutting apparatus and a laser cutting method are provided. A laser cutting method includes: preparing an object on a stage; cutting the object into a set shape by relatively moving and irradiating a laser beam along the set shape with respect to the object; and performing uniform heating compensation to reduce accumulation of thermal energy of the laser beam resulting from a change of speed at a shift point where a travelling direction of the laser beam with respect to the object changes.

公开(公告)号：US11637270B2

公开(公告)日：2023-04-25

申请号：US17073726

申请日：2020-10-19

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Geunwoo Yug ,  Myeongseok Jeong ,  Soobum Park ,  Junghwa You ,  Ilyoung Jeong

IPC: H01L51/56 ,  H01L27/32 ,  H01L51/00 ,  H01L51/52

Abstract: A method of manufacturing a display apparatus includes separating a mother substrate that includes a plurality of connected unit display apparatuses into a plurality of separated unit display apparatuses. Each separated unit display apparatus includes a display panel and at least one supporting unit attached below the display panel. The display panel includes a display substrate that has a pad area on which are disposed a plurality of pads and a thin film encapsulation layer on the display substrate. The method further includes consecutively cutting the display panel and the at least one supporting unit of each separated unit display apparatus along cutting lines in the pad area, where a first cut surface of the pad area of the display substrate and a second cut surface of the at least one supporting unit are respectively cut at different angles.

公开(公告)号：US20210036267A1

公开(公告)日：2021-02-04

申请号：US17073726

申请日：2020-10-19

Applicant: Samsung Display Co., Ltd.

Inventor： Geunwoo Yug ,  Myeongseok Jeong ,  Soobum Park ,  Junghwa You ,  Ilyoung Jeong

IPC: H01L51/56 ,  H01L27/32 ,  H01L51/00 ,  H01L51/52

Abstract: A method of manufacturing a display apparatus includes separating a mother substrate that includes a plurality of connected unit display apparatuses into a plurality of separated unit display apparatuses. Each separated unit display apparatus includes a display panel and at least one supporting unit attached below the display panel. The display panel includes a display substrate that has a pad area on which are disposed a plurality of pads and a thin film encapsulation layer on the display substrate. The method further includes consecutively cutting the display panel and the at least one supporting unit of each separated unit display apparatus along cutting lines in the pad area, where a first cut surface of the pad area of the display substrate and a second cut surface of the at least one supporting unit are respectively cut at different angles.

公开(公告)号：US10811640B2

公开(公告)日：2020-10-20

申请号：US16164243

申请日：2018-10-18

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Geunwoo Yug ,  Myeongseok Jeong ,  Soobum Park ,  Junghwa You ,  Ilyoung Jeong

IPC: H01L51/56 ,  H01L27/32 ,  H01L51/00 ,  H01L51/52

Abstract: A method of manufacturing a display apparatus includes separating a mother substrate that includes a plurality of connected unit display apparatuses into a plurality of separated unit display apparatuses. Each separated unit display apparatus includes a display panel and at least one supporting unit attached below the display panel. The display panel includes a display substrate that has a pad area on which are disposed a plurality of pads and a thin film encapsulation layer on the display substrate. The method further includes consecutively cutting the display panel and the at least one supporting unit of each separated unit display apparatus along cutting lines in the pad area, where a first cut surface of the pad area of the display substrate and a second cut surface of the at least one supporting unit are respectively cut at different angles.

公开(公告)号：US20190259977A1

公开(公告)日：2019-08-22

申请号：US16164243

申请日：2018-10-18

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Geunwoo Yug ,  Myeongseok Jeong ,  Soobum Park ,  Junghwa You ,  Ilyoung Jeong

IPC: H01L51/56 ,  H01L27/32 ,  H01L51/00 ,  H01L51/52

Abstract: A method of manufacturing a display apparatus includes separating a mother substrate that includes a plurality of connected unit display apparatuses into a plurality of separated unit display apparatuses. Each separated unit display apparatus includes a display panel and at least one supporting unit attached below the display panel. The display panel includes a display substrate that has a pad area on which are disposed a plurality of pads and a thin film encapsulation layer on the display substrate. The method further includes consecutively cutting the display panel and the at least one supporting unit of each separated unit display apparatus along cutting lines in the pad area, where a first cut surface of the pad area of the display substrate and a second cut surface of the at least one supporting unit are respectively cut at different angles.

公开(公告)号：US12144238B2

公开(公告)日：2024-11-12

申请号：US18191135

申请日：2023-03-28

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Geunwoo Yug ,  Myeongseok Jeong ,  Soobum Park ,  Junghwa You ,  Ilyoung Jeong

IPC: H10K71/00 ,  H10K50/86 ,  H10K59/12 ,  H10K59/40 ,  H10K71/80 ,  H10K77/10 ,  H10K102/00

Abstract: A method of manufacturing a display apparatus includes separating a mother substrate that includes a plurality of connected unit display apparatuses into a plurality of separated unit display apparatuses. Each separated unit display apparatus includes a display panel and at least one supporting unit attached below the display panel. The display panel includes a display substrate that has a pad area on which are disposed a plurality of pads and a thin film encapsulation layer on the display substrate. The method further includes consecutively cutting the display panel and the at least one supporting unit of each separated unit display apparatus along cutting lines in the pad area, where a first cut surface of the pad area of the display substrate and a second cut surface of the at least one supporting unit are respectively cut at different angles.

公开(公告)号：US20180133842A1

公开(公告)日：2018-05-17

申请号：US15814231

申请日：2017-11-15

Applicant: Samsung Display Co., Ltd.

Inventor： Ilyoung Jeong ,  Gyoowan Han ,  Jaeil Kim ,  Kuhyun Kang ,  Soobum Park

IPC: B23K26/38 ,  B23K26/04 ,  B23K26/0622

CPC classification number: B23K26/38 ,  B23K26/03 ,  B23K26/04 ,  B23K26/0622 ,  B23K26/082 ,  B23K26/0853 ,  B23K26/0876 ,  B23K26/402 ,  B23K2103/54 ,  C03B33/04 ,  C03B33/091

Abstract: A laser cutting apparatus and a laser cutting method are provided. A laser cutting method includes: preparing an object on a stage; cutting the object into a set shape by relatively moving and irradiating a laser beam along the set shape with respect to the object; and performing uniform heating compensation to reduce accumulation of thermal energy of the laser beam resulting from a change of speed at a shift point where a travelling direction of the laser beam with respect to the object changes.