公开(公告)号：US20240261893A1

公开(公告)日：2024-08-08

申请号：US18441493

申请日：2024-02-14

Applicant: ROFIN-SINAR TECHNOLOGIES LLC

Inventor： S. Abbas HOSSEINI

IPC: B23K26/06 ,  B23K26/00 ,  B23K26/0622 ,  B23K26/082 ,  B23K26/38 ,  B23K26/53 ,  B23K103/00 ,  C03B33/02 ,  C03B33/033 ,  C03B33/04 ,  C03B33/07 ,  C03B33/09 ,  C03C14/00 ,  H01L21/78

CPC classification number: B23K26/0626 ,  B23K26/0006 ,  B23K26/0624 ,  B23K26/0648 ,  B23K26/082 ,  B23K26/38 ,  B23K26/53 ,  C03B33/0222 ,  C03B33/07 ,  C03B33/09 ,  C03C14/002 ,  H01L21/78 ,  B23K2103/00 ,  B23K2103/42 ,  B23K2103/50 ,  B23K2103/52 ,  B23K2103/54 ,  B23K2103/56 ,  C03B33/033 ,  C03B33/04 ,  C03C2214/02

Abstract: Systems and methods are described for forming continuous laser filaments in transparent materials. A burst of ultrafast laser pulses is focused such that a beam waist is formed external to the material being processed without forming an external plasma channel, while a sufficient energy density is formed within an extended region within the material to support the formation of a continuous filament, without causing optical breakdown within the material. Filaments formed according to this method may exhibit lengths exceeding up to 10 mm. In some embodiments, an aberrated optical focusing element is employed to produce an external beam waist while producing distributed focusing of the incident beam within the material. Various systems are described that facilitate the formation of filament arrays within transparent substrates for cleaving/singulation and/or marking. Optical monitoring of the filaments may be employed to provide feedback to facilitate active control of the process.

公开(公告)号：US12017943B2

公开(公告)日：2024-06-25

申请号：US17375364

申请日：2021-07-14

Applicant: Schott AG

Inventor： Andreas Ortner ,  Andreas Roters ,  Frank-Thomas Lentes ,  Lutz Parthier ,  Markus Heiss-Chouquet ,  Ulrich Peuchert ,  Fabian Wagner ,  Florian Resch ,  Laura Brückbauer ,  Matthias Jotz ,  Vanessa Gläßer

IPC: C03B33/04 ,  C03B33/02 ,  C03B33/06 ,  C03B33/07 ,  C03B33/08 ,  C03C15/00 ,  C03C23/00 ,  B23K26/0622 ,  B23K103/00 ,  C03B33/023

CPC classification number: C03B33/0222 ,  C03B33/04 ,  C03B33/06 ,  C03B33/074 ,  C03B33/082 ,  C03C15/00 ,  C03C23/0025 ,  B23K26/0622 ,  B23K26/0624 ,  B23K2103/54 ,  C03B33/023

Abstract: A plate-like glass element includes a pair of opposite side faces and an opening having a transverse dimension of at least 200 μm. The opening is delimited by an edge. The edge has a plurality of rounded, substantially hemispherical depressions that adjoin one another. The plurality of rounded, substantially hemispherical depressions having abutting concave roundings which form ridges.

公开(公告)号：US11884582B2

公开(公告)日：2024-01-30

申请号：US17631440

申请日：2020-07-31

Applicant: HOYA CORPORATION

Inventor： Shuhei Azuma

IPC: C03C23/00 ,  C03B29/02 ,  B23K26/354 ,  B23K26/352 ,  G11B5/73 ,  G11B5/84 ,  B23K103/00 ,  C03B33/04 ,  C03B33/09

CPC classification number: C03C23/0025 ,  B23K26/354 ,  B23K26/3576 ,  C03B29/025 ,  G11B5/73921 ,  G11B5/8404 ,  B23K2103/54 ,  C03B33/04 ,  C03B33/091

Abstract: A method for manufacturing an annular glass plate that has an outer circumferential edge surface, an inner circumferential edge surface, and a thickness not larger than 0.6 mm includes processing for manufacturing an annular glass plate by irradiating each of the outer circumferential edge surface and the inner circumferential edge surface of an annular glass blank with a laser beam to melt the outer circumferential edge surface and the inner circumferential edge surface and form molten surfaces such that the molten surfaces in the outer circumferential edge surface and the inner circumferential edge surface each have an arithmetic average surface roughness Ra not larger than 0.1 μm, and the surface roughness of the molten surface in the inner circumferential edge surface becomes larger than the surface roughness of the molten surface in the outer circumferential edge surface.

公开(公告)号：US20220289615A1

公开(公告)日：2022-09-15

申请号：US17634158

申请日：2020-08-11

Applicant: CORNING INCORPORATED

Inventor： Thomas Mikio Wynne

IPC: C03B33/02 ,  B81C3/00 ,  G02B3/00 ,  C03B23/203 ,  C03B33/04

Abstract: A method of forming a bond between substrates and manipulating the bond comprises: emitting a first laser energy onto a strip of an absorption material disposed between a first substrate and a second substrate until the strip diffuses into the first substrate and the second substrate resulting in workpiece with a bond between the first substrate and the second substrate; emitting a second laser energy through the workpiece at the bond to create a fault line through the bond, the first substrate, and the second substrate, the second laser energy provided by an approximated Bessel beam, the approximated Bessel beam incident upon the bond having a diameter that is greater than a width of the bond; and repeating emitting the second laser energy step along a length of the bond to create a series of fault lines through the bond, the series of fault lines forming a contour.

公开(公告)号：US20220081342A1

公开(公告)日：2022-03-17

申请号：US17403987

申请日：2021-08-17

Applicant: CORNING INCORPORATED

Inventor： Anping Liu ,  Craig John Mancusi Ungaro

IPC: C03B33/02 ,  C03B33/04 ,  B23K26/00

Abstract: A method for processing a transparent workpiece that includes directing a laser beam output by a beam source onto a phase-adjustment device such that the laser beam downstream the phase-adjustment device is an Airy beam and directing the Airy beam onto a surface of the transparent workpiece. The Airy beam forms an Airy beam focal region in the transparent workpiece, the Airy beam of the Airy beam focal region having a maximum intensity of 100 TW/cm2 or less, the Airy beam of the Airy beam focal region induces absorption in the transparent workpiece, the induced absorption producing a curved defect in the transparent workpiece.

公开(公告)号：US11247932B2

公开(公告)日：2022-02-15

申请号：US16257853

申请日：2019-01-25

Applicant: CORNING INCORPORATED

Inventor： Jeffery Alan DeMeritt ,  Davide Domenico Fortusini ,  Andrey Kobyakov ,  David Mark Lance ,  Leonard Thomas Masters ,  Ulrich Wilhelm Heinz Neukirch ,  Alexander Mikhailovich Streltsov ,  James Scott Sutherland

IPC: B23K26/38 ,  C03B33/08 ,  C03B33/02 ,  G02B6/36 ,  C03B33/04 ,  B23K26/384 ,  B23K26/00 ,  B23K26/06 ,  B23K26/40 ,  B23K26/122

Abstract: The liquid-assisted micromachining methods include methods of processing a substrate made of a transparent dielectric material. A working surface of the substrate is placed in contact with a liquid-assist medium that comprises fluorine. A focused pulsed laser beam is directed through a first substrate surface and through the opposite working surface to form a focus spot in the liquid-assist medium. The focus spot is then moved over a motion path from its initial position in the liquid-assist medium through the substrate body in the general direction from the working surface to the first surface to create a modification of the transparent dielectric material that defines in the body a core portion. The core portion is removed to form the substrate feature, which can be a through or closed fiber hole that supports one or more optical fibers. Optical components formed using the processed substrate are also disclosed.

公开(公告)号：US20210347673A1

公开(公告)日：2021-11-11

申请号：US17383708

申请日：2021-07-23

Applicant: CORNING INCORPORATED

Inventor： Bradley Frederick Bowden ,  Xiaoju Guo ,  Thomas Hackert ,  Garrett Andrew Piech ,  Kristopher Allen Wieland

IPC: C03B33/02 ,  C03B33/04 ,  C03B33/09 ,  B23K26/53

Abstract: A method for cutting, separating and removing interior contoured shapes in thin substrates, particularly glass substrates. The method involves the utilization of an ultra-short pulse laser to form defect lines in the substrate that may be followed by use of a second laser beam to promote isolation of the part defined by the interior contour.

公开(公告)号：US11130200B2

公开(公告)日：2021-09-28

申请号：US16086533

申请日：2017-03-22

Applicant: Siltectra GmbH

Inventor： Ralf Rieske ,  Marko Swoboda ,  Jan Richter

IPC: B23K26/38 ,  B23K26/40 ,  B23K26/36 ,  B23K26/53 ,  B23K26/073 ,  B23K26/08 ,  C03B33/04 ,  C03B33/09

Abstract: A method for producing a solid body layer having a domed or curved shape at least in sections includes: irradiating a surface of the solid body by laser beams emitted from a laser application device to produce a modified region within the solid body that includes modifications having an extension in a longitudinal direction of the solid body, the longitudinal extension extending orthogonally to the irradiated solid body surface, wherein the modifications are configured to guide a crack for detaching the solid body layer upon application of an external force; and enlarging the extension of the modified region in the longitudinal direction to increase stress produced by the modified region in unmodified material of the solid body, wherein enlarging the extension of the modified region in the longitudinal direction increases the probability of spontaneous splitting of the solid body layer from the solid body without application of the external force.

公开(公告)号：US11111170B2

公开(公告)日：2021-09-07

申请号：US16097999

申请日：2017-05-04

Applicant: CORNING INCORPORATED

Inventor： Bradley Frederick Bowden ,  Xiaoju Guo ,  Thomas Hackert ,  Garrett Andrew Piech ,  Kristopher Allen Wieland

IPC: B23K26/38 ,  B23K26/50 ,  C03B33/02 ,  C03B33/04 ,  C03B33/09 ,  B23K26/53 ,  B23K103/00

Abstract: A method for cutting, separating and removing interior contoured shapes in thin substrates, particularly glass substrates. The method involves the utilization of an ultra-short pulse laser to form defect lines in the substrate that may be followed by use of a second laser beam to promote isolation of the part defined by the interior contour.

公开(公告)号：US11084752B2

公开(公告)日：2021-08-10

申请号：US16680904

申请日：2019-11-12

Applicant: SAINT-GOBAIN GLASS FRANCE

Inventor： Thierry Dumenil ,  Dominique Bureloux

IPC: C03B33/04 ,  C03B33/023 ,  C03B33/033

Abstract: The method includes tracing a score line on the surface of the glass, using a scoring tool, and breaking out using a local pressure system applied on the opposite face and opposite the score line, the local pressure system being moved and pressed along the score line on the opposite face.