Invention Grant
- Patent Title: Electronic component
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Application No.: US15695645Application Date: 2017-09-05
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Publication No.: US10755861B2Publication Date: 2020-08-25
- Inventor: Shinya Onodera , Koki Ito , Hideki Kaneko
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@6e739fa5
- Main IPC: H01G4/018
- IPC: H01G4/018 ; H01G4/005 ; H01G4/232 ; H01G4/30 ; H01G2/06 ; H01G4/12

Abstract:
An electronic component includes an element body of a rectangular parallelepiped shape, an external electrode, and an insulating film. The element body includes a first principal surface as a mounting surface, and a first side surface adjacent to the first principal surface. The external electrode includes a first electrode part and a second electrode part. The first electrode part is disposed on the first principal surface. The second electrode part is disposed on the first side surface and connected to the first electrode part. The insulating film continuously covers an end edge of the first electrode part and at least a part of an end edge of the second electrode part.
Public/Granted literature
- US20180075972A1 ELECTRONIC COMPONENT Public/Granted day:2018-03-15
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