- Patent Title: Substrate transfer mechanism to reduce back-side substrate contact
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Application No.: US15894735Application Date: 2018-02-12
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Publication No.: US10755955B2Publication Date: 2020-08-25
- Inventor: Masato Ishii , Richard O. Collins , Richard Giljum , Alexander Berger
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- Main IPC: H01L21/677
- IPC: H01L21/677 ; H01L21/687 ; H01L21/673 ; H01L21/68 ; H01L21/67

Abstract:
A substrate processing system is disclosed which includes a substrate input/output chamber coupled to a transfer chamber, and one or more processing chambers coupled to the transfer chamber, wherein the substrate input/output chamber includes a plurality of stacked carrier holders, and a platen, wherein the platen includes a plurality of alignment pads and a plurality of openings formed in a recessed flange along a peripheral edge of the platen.
Public/Granted literature
- US20190252229A1 SUBSTRATE TRANSFER MECHANISM TO REDUCE BACK-SIDE SUBSTRATE CONTACT Public/Granted day:2019-08-15
Information query
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