- 专利标题： Semiconductor tool with a shield
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申请号： US16504129申请日： 2019-07-05
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公开(公告)号： US10755961B2公开(公告)日： 2020-08-25
- 发明人: Tzung-Chen Wu , Tzu Wei Yu , Cheng Yu Wu
- 申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址： TW Hsinchu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsinchu
- 代理机构： Slater Matsil, LLP
- 主分类号： H01L21/687
- IPC分类号： H01L21/687 ; H01L21/67 ; B25J11/00 ; B25J15/00 ; H01L21/677
摘要：
A method includes loading a wafer onto a robot arm, wherein a shield is disposed over the wafer, moving the wafer from a first location to a second location, and unloading the wafer from the robot arm.
公开/授权文献
- US20190326151A1 SEMICONDUCTOR TOOL WITH A SHIELD 公开/授权日：2019-10-24
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