Invention Grant
- Patent Title: Packaged power device having improved heat dissipation capacity and better thermal performances
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Application No.: US16239333Application Date: 2019-01-03
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Publication No.: US10756002B2Publication Date: 2020-08-25
- Inventor: Cristiano Gianluca Stella , Francesco Salamone
- Applicant: STMICROELECTRONICS S.R.L.
- Applicant Address: IT Agrate Brianza
- Assignee: STMICROELECTRONICS S.R.L.
- Current Assignee: STMICROELECTRONICS S.R.L.
- Current Assignee Address: IT Agrate Brianza
- Agency: Seed Intellectual Property Law Group LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@34ec4b5
- Main IPC: H01L23/473
- IPC: H01L23/473 ; H01L23/367 ; H01L23/433 ; H01L23/04 ; H01L23/40 ; H01L23/373

Abstract:
A packaged device, having a package, including a first dissipative region, a second dissipative region, a first connection element and a second connection element. A die of semiconductor material is arranged within the package, carried by the first dissipative region. The first and second dissipative regions extend at a distance from each other, and the first and second connection elements extend at a distance from each other between the first and second dissipative regions. The first dissipative region, the second dissipative region, the first connection element, and the second connection element are hollow and form a circuit containing a cooling liquid.
Public/Granted literature
- US20190221500A1 PACKAGED POWER DEVICE HAVING IMPROVED HEAT DISSIPATION CAPACITY AND BETTER THERMAL PERFORMANCES Public/Granted day:2019-07-18
Information query
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