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    Power electronic device
    3.
    发明授权
    Power electronic device 有权
    电力电子设备

    公开(公告)号：US08963303B2

    公开(公告)日：2015-02-24

    申请号：US14182156

    申请日：2014-02-17

    Applicant: STMicroelectronics S.r.l.

    Inventor： Cristiano Gianluca Stella ,  Fabio Criscione ,  Gaetano Pignataro

    IPC: H01L23/495 ,  H01L23/10 ,  H01L27/02 ,  H01L23/00 ,  H01L23/31

    CPC classification number: H01L27/0251 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/34 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L2224/371 ,  H01L2224/40137 ,  H01L2224/40245 ,  H01L2224/48247 ,  H01L2224/73221 ,  H01L2924/181 ,  H01L2924/00012

    Abstract: A device includes a first and second transistors integrated in first and second chips. Each chip has opposed rear and front surfaces, and further has a first conduction terminal and a control terminal on the front surface and a second conduction terminal on the rear surface. The first and second transistors are electrically connected in series by having the first conduction terminals of the first and second transistors be electrically connected. The device includes a common package enclosing the first and second chips, the common package having an insulating body with a mounting surface. A heat sink is also enclosed within the insulating body, the heat sink making electrical contact with the first conduction terminals of the first and second chips on the respective front surfaces, so that the first conduction terminals are electrically connected together through the heat sink.

    Abstract translation: 一种器件包括集成在第一和第二芯片中的第一和第二晶体管。 每个芯片具有相对的后表面和前表面，并且还具有前表面上的第一导电端子和控制端子以及后表面上的第二导电端子。 第一和第二晶体管通过使第一和第二晶体管的第一导电端子电连接而串联电连接。 该装置包括封装第一和第二芯片的公共封装，公共封装具有带有安装表面的绝缘体。 散热器也封装在绝缘体内，散热片与相应前表面上的第一和第二芯片的第一导电端子电接触，使得第一导电端子通过散热器电连接在一起。

    MANUFACTURING OF A HEAT SINK BY WAVE SOLDERING
    4.
    发明申请
    MANUFACTURING OF A HEAT SINK BY WAVE SOLDERING 有权
    通过波浪焊接制造散热器

    公开(公告)号：US20140301042A1

    公开(公告)日：2014-10-09

    申请号：US14225625

    申请日：2014-03-26

    Applicant: STMicroelectronics S.r.l.

    Inventor： Cristiano Gianluca Stella ,  Rosalba Cacciola ,  Giuseppe Luigi Malgioglio

    IPC: H05K1/02 ,  H05K13/04

    CPC classification number: H05K1/0204 ,  B23K1/0016 ,  B23K1/085 ,  B23K35/025 ,  H01L23/3677 ,  H01L2224/13 ,  H01L2924/13091 ,  H05K1/181 ,  H05K13/0465 ,  H05K2201/066 ,  H01L2924/00

    Abstract: An electronic device is attached to a first surface of a board which includes vias. A heat sink precursor for the electronic device is attached to the second surface of the electronic board. The heat sink precursor includes a cavity facing the vias. A wave of solder paste is applied to the second surface. The solder paste penetrates into the cavity of the heat sink precursor and flows by capillary action through the vias to weld a thermal radiator and/or electronic contact of the electronic device to the vias. The solder paste further remains in the cavity to form a corresponding heat sink.

    Abstract translation: 电子设备附接到包括通孔的板的第一表面。 用于电子设备的散热器前体附着到电子板的第二表面。 散热器前体包括面向通孔的空腔。 将一波焊膏施加到第二表面。 焊膏渗透到散热器前体的空腔中并通过毛细作用流过通孔，以将电子器件的散热器和/或电子接触焊接到通孔。 焊膏进一步保留在空腔中以形成相应的散热器。

    Power semiconductor device with a double island surface mount package
    8.
    发明授权
    Power semiconductor device with a double island surface mount package 有权

    公开(公告)号：US10910302B2

    公开(公告)日：2021-02-02

    申请号：US16385928

    申请日：2019-04-16

    Applicant: STMicroelectronics S.r.l.

    Inventor： Cristiano Gianluca Stella ,  Agatino Minotti

    IPC: H01L23/498 ,  H01L23/373

    Abstract: A power semiconductor device including a first and second die, each including a plurality of conductive contact regions and a passivation region including a number of projecting dielectric regions and a number of windows. Adjacent windows are separated by a corresponding projecting dielectric region with each conductive contact region arranged within a corresponding window. A package of the surface mount type houses the first and second dice. The package includes a first bottom insulation multilayer and a second bottom insulation multilayer carrying, respectively, the first and second dice. A covering metal layer is arranged on top of the first and second dice and includes projecting metal regions extending into the windows to couple electrically with corresponding conductive contact regions. The covering metal layer moreover forms a number of cavities, which are interposed between the projecting metal regions so as to overlie corresponding projecting dielectric regions.

    THROUGH-HOLE MOUNTING SYSTEM WITH HEAT SINKING ELEMENTS CLAMPED TO ONE ANOTHER AGAINST INSULATING BODY
    9.
    发明申请
    THROUGH-HOLE MOUNTING SYSTEM WITH HEAT SINKING ELEMENTS CLAMPED TO ONE ANOTHER AGAINST INSULATING BODY 有权
    具有热封孔元件的通孔安装系统固定在另一个对抗绝缘体上

    公开(公告)号：US20130294032A1

    公开(公告)日：2013-11-07

    申请号：US13871803

    申请日：2013-04-26

    Applicant: STMicroelectronics S.r.l.

    Inventor： Cristiano Gianluca Stella

    IPC: H01L23/38 ,  H05K13/00 ,  H05K7/20

    CPC classification number: H05K7/20 ,  H01L21/302 ,  H01L23/02 ,  H01L23/34 ,  H01L23/367 ,  H01L23/3672 ,  H01L23/38 ,  H01L23/4006 ,  H01L23/4093 ,  H01L23/48 ,  H01L2924/0002 ,  H05K7/2039 ,  H05K13/00 ,  Y10T29/49002 ,  H01L2924/00

    Abstract: An electronic system includes an electronic device of through-hole mounting type comprising an insulating body for embedding at least a chip on which electronic components are integrated, a plurality of conductive leads projecting from the insulating body for said mounting, and a dissipation plate exposed from the insulating body for transferring heat from said electronic component in operation towards the outside of the insulating body. The electronic system includes a heat sink in contact with said dissipation plate for dissipating said heat. The heat sink comprises a first dissipation element, a second dissipation element, and clamping means for clamping the first dissipation element and the second dissipation element together against the insulating body of said electronic device.

    Abstract translation: 一种电子系统，包括通孔安装型电子装置，该电子装置包括绝缘体，用于至少嵌入电子部件一体化的芯片，从用于所述安装的绝缘体突出的多个导电引线以及从该绝缘体露出的散热板 所述绝缘体用于将来自所述电子部件的热量在操作中传递到所述绝缘体的外部。 电子系统包括与所述散热板接触以散热所述热量的散热器。 散热器包括第一耗散元件，第二耗散元件和夹持装置，用于将第一耗散元件和第二耗散元件夹在一起抵靠所述电子器件的绝缘体。

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