- 专利标题： Method of forming a laminate structure having a plated through-hole using a removable cover layer
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申请号： US14312679申请日： 2014-06-23
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公开(公告)号： US10757819B2公开(公告)日： 2020-08-25
- 发明人: Shinichi Iketani , Dale Kersten
- 申请人： Sanmina Corporation
- 申请人地址： US CA San Jose
- 专利权人： SANMINA CORPORATION
- 当前专利权人： SANMINA CORPORATION
- 当前专利权人地址： US CA San Jose
- 代理机构： Loza & Loza, LLP
- 代理商 Julio M. Loza; Tyler J. Barrett
- 主分类号： H05K3/26
- IPC分类号： H05K3/26 ; H05K1/03 ; H05K1/05 ; H05K3/00 ; H05K3/42
摘要：
A core or sub-composite structure is provided including a dielectric layer between a first conductive film and a second conductive film. The first conductive film may include a first peelable/removable cover layer formed on or coupled to a first conductive layer. The second conductive film may include a second peelable/removable cover layer formed on or coupled to a second conductive layer.
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