Invention Grant
- Patent Title: Method for processing product wafers using carrier substrates
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Application No.: US14711352Application Date: 2015-05-13
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Publication No.: US10759660B2Publication Date: 2020-09-01
- Inventor: Jonathan Hammond , Jan Edward Vandemeer , Julio Costa
- Applicant: RF Micro Devices, Inc.
- Applicant Address: US NC Greensboro
- Assignee: Qorvo US, Inc.
- Current Assignee: Qorvo US, Inc.
- Current Assignee Address: US NC Greensboro
- Agency: Withrow & Terranova, P.L.L.C.
- Main IPC: B81C1/00
- IPC: B81C1/00

Abstract:
A method for processing product wafers using carrier substrates is disclosed. The method includes a step of bonding a first carrier wafer to a first product wafer using a first temporary adhesion layer between a first carrier wafer surface and a first product wafer first surface. Another step includes bonding a second carrier wafer to a second product wafer using a second temporary adhesion layer between a second carrier wafer surface and a second product wafer surface. Another step includes bonding the first product wafer to the second product wafer using a permanent bond between a first product wafer second surface and a second product wafer first surface. In exemplary embodiments, at least one processing step is performed on the first product wafer after the first temporary carrier wafer is bonded to the first product wafer before the second product wafer is permanently bonded to the first product wafer.
Public/Granted literature
- US20150329355A1 METHOD FOR PROCESSING PRODUCT WAFERS USING CARRIER SUBSTRATES Public/Granted day:2015-11-19
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