Invention Grant
- Patent Title: Powder for additive modeling, structure, semiconductor production device component, and semiconductor production device
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Application No.: US16178884Application Date: 2018-11-02
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Publication No.: US10759712B2Publication Date: 2020-09-01
- Inventor: Nobuhiro Yasui , Hisato Yabuta , Kanako Oshima
- Applicant: CANON KABUSHIKI KAISHA
- Applicant Address: JP Tokyo
- Assignee: CANON KABUSHIKI KAISHA
- Current Assignee: CANON KABUSHIKI KAISHA
- Current Assignee Address: JP Tokyo
- Agency: Venable LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@5be75995 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@5bcb06c3
- Main IPC: C04B35/581
- IPC: C04B35/581 ; C04B35/5833 ; C04B35/584 ; B22F3/105 ; B28B1/00 ; C04B35/64 ; B33Y70/00 ; B33Y10/00 ; B33Y80/00 ; C04B35/653 ; C04B35/117 ; G03F1/00 ; C04B35/50
Abstract:
A material powder for additive modeling including a nitride, and a eutectic oxide, the nitride having an average density lower than an average density of the eutectic oxide, is used to produce a structure using an additive modeling method.
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