Invention Grant
- Patent Title: Methods and apparatus for depositing yttrium-containing films
-
Application No.: US15649584Application Date: 2017-07-13
-
Publication No.: US10760159B2Publication Date: 2020-09-01
- Inventor: Lakmal C. Kalutarage , Mark Saly , Thomas Knisley , Benjamin Schmiege , David Thompson
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Servilla Whitney LLC
- Main IPC: C23C16/455
- IPC: C23C16/455 ; C23C16/34 ; C23C16/458 ; C23C16/52 ; C23C16/56
Abstract:
Methods for depositing a yttrium-containing film through an atomic layer deposition process are described. Some embodiments of the disclosure utilize a plasma-enhanced atomic layer deposition process. Also described is an apparatus for performing the atomic layer deposition of the yttrium containing films.
Public/Granted literature
- US20190017171A1 Methods and Apparatus for Depositing Yttrium-Containing Films Public/Granted day:2019-01-17
Information query
IPC分类:
