Invention Grant
- Patent Title: Packaged semiconductor components having substantially rigid support members
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Application No.: US16391732Application Date: 2019-04-23
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Publication No.: US10763185B2Publication Date: 2020-09-01
- Inventor: Matt E. Schwab , J. Michael Brooks , David J. Corisis
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Perkins Coie LLP
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L23/16 ; H01L23/00 ; H01L25/065 ; H01L23/492 ; H01L23/36
Abstract:
Packaged semiconductor components having substantially rigid support member are disclosed. The packages can include a semiconductor die and a support member proximate to the semiconductor die. The support member is at least substantially rigid. The packages can further include an adhesive between the support member and the semiconductor die and adhesively attaching the support member to the semiconductor die. The packages can also include a substrate carrying the semiconductor die and the support member attached to the semiconductor die.
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Information query
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