Invention Grant
- Patent Title: Method of aligning semiconductor chips, method of arranging semiconductor chips, device that produces a semiconductor component, and semiconductor component
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Application No.: US16329449Application Date: 2017-08-30
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Publication No.: US10763238B2Publication Date: 2020-09-01
- Inventor: Philipp Kreuter , Andreas Biebersdorf , Christoph Klemp , Jens Ebbecke , Ines Pietzonka , Petrus Sundgren
- Applicant: OSRAM Opto Semiconductors GmbH
- Applicant Address: DE Regensburg
- Assignee: OSRAM OLED GmbH
- Current Assignee: OSRAM OLED GmbH
- Current Assignee Address: DE Regensburg
- Agency: DLA Piper LLP (US)
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@34ec4b5
- International Application: PCT/EP2017/071797 WO 20170830
- International Announcement: WO2018/041909 WO 20180308
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L33/00 ; H01L25/075
Abstract:
A method of aligning semiconductor chips in a medium includes providing an electrically insulating liquid medium; providing semiconductor chips; forming a suspension with the medium and the semiconductor chips; exposing the semiconductor chips to electromagnetic radiation that generates free charge carriers in the semiconductor chips; arranging the suspension in an electric field in which the semiconductor chips are aligned along the electric field; and curing the medium after aligning the semiconductor chips.
Public/Granted literature
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