- 专利标题: Integrated power module and capacitor module thermal and packaging design
-
申请号: US16283626申请日: 2019-02-22
-
公开(公告)号: US10765042B1公开(公告)日: 2020-09-01
- 发明人: Fan Wang , Lihua Chen , Joseph Sherman Kimmel
- 申请人: FORD GLOBAL TECHNOLOGIES, LLC
- 申请人地址: US MI Dearborn
- 专利权人: FORD GLOBAL TECHNOLOGIES, LLC
- 当前专利权人: FORD GLOBAL TECHNOLOGIES, LLC
- 当前专利权人地址: US MI Dearborn
- 代理机构: Brooks Kushman P.C.
- 代理商 David Kelley
- 主分类号: H02B1/48
- IPC分类号: H02B1/48 ; H05K7/02 ; H05K7/20 ; F28D9/00 ; H02G5/02 ; H02M7/00
摘要:
An integrated capacitor and power module include a power module, an intermediate cold plate, and a capacitor module. The intermediate cold plate has a first side attached to the power module and a second side opposite the first side. The capacitor module is attached to a second side of the intermediate cold plate. The capacitor module includes a plurality of metalized film capacitor cells supported by a metal plate and a base cold plate with a layer of thermal interface material between the metal plate and the base cold plate. A fluid circulation system is operatively connected to the intermediate cold plate to circulate a fluid through the cold plate. The capacitor module includes a housing, a plurality of capacitor cells and first and second busbars. Alternating cell arrays have a P-end and an N-end that are inverted relative to each other.
公开/授权文献
信息查询
IPC分类: