Invention Grant
- Patent Title: Components and systems for cleaning a tool for forming a semiconductor device, and related methods
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Application No.: US15856373Application Date: 2017-12-28
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Publication No.: US10766057B2Publication Date: 2020-09-08
- Inventor: Ken Tokashiki , Gurtej S. Sandhu
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: TraskBritt
- Main IPC: B08B9/00
- IPC: B08B9/00 ; B08B7/00 ; H01L21/67 ; H01L21/683
Abstract:
A method of cleaning a tool for forming a semiconductor device includes heating a wafer comprising a ceramic material to heat at least the ceramic material, positioning the heated wafer on an electrostatic chuck of a tool for forming a semiconductor device such that deposits located proximate the heated wafer are heated to vaporize at least some of the deposits, and removing the vaporized deposits from the tool. Related methods of forming semiconductor devices, related systems, and related cleaning wafers are disclosed.
Public/Granted literature
- US20190201945A1 COMPONENTS AND SYSTEMS FOR CLEANING A TOOL FOR FORMING A SEMICONDUCTOR DEVICE, AND RELATED METHODS Public/Granted day:2019-07-04
Information query
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