Invention Grant
- Patent Title: Multilayer capacitor
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Application No.: US16396054Application Date: 2019-04-26
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Publication No.: US10770234B2Publication Date: 2020-09-08
- Inventor: Jung Min Kim , Bon Seok Koo , Chang Hak Choi , Hae Sol Kang , Ji Hye Han , Byung Woo Kang
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Morgan, Lewis & Bockius LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@212ec3a9 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@71ba4ecd
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/232 ; H01G4/33 ; H01G4/012 ; H01G4/12 ; H01G4/008 ; H01G4/248

Abstract:
A multilayer capacitor may have a decreased equivalent series resistance (ESR) and improved warpage strength and reliability with conductive resin layers of external electrodes on surfaces where internal electrodes are exposed from a body, intermetallic compounds are in contact with conductive connecting portions of the conductive resin layers and the internal electrodes, and conductive connecting portions are in contact with a plurality of metal particles and second electrode layers.
Public/Granted literature
- US20190252123A1 MULTILAYER CAPACITOR Public/Granted day:2019-08-15
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