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    Multilayer capacitor and board having the same mounted thereon
    7.
    发明授权
    Multilayer capacitor and board having the same mounted thereon 有权

    公开(公告)号：US12148574B2

    公开(公告)日：2024-11-19

    申请号：US18239911

    申请日：2023-08-30

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： San Kyeong ,  Chang Hak Choi ,  Jae Seok Yi ,  Bon Seok Koo ,  Jung Min Kim ,  Hae Sol Kang ,  Jun Hyeon Kim

    IPC: H01G4/30 ,  H01G2/06 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12

    Abstract: A multilayer capacitor includes a capacitor body including a dielectric layer and a plurality of internal electrodes, and external electrodes disposed on both ends of the capacitor body and connected to exposed portions of the plurality of internal electrodes, respectively. Each of the external electrodes includes a conductive layer disposed on the capacitor body to be connected to one or more of the plurality of internal electrodes, a conductive resin layer covering the conductive layer, and including a plurality of metal particles, a plurality of elastic fine powder particles each having an elastic powder particle and a metal film plated on a surface of the elastic powder particle, and a conductive resin surrounding the plurality of metal particles and the plurality of elastic fine powder particles and contacting the conductive layer, and a plating layer covering the conductive resin layer.

    MULTILAYER CAPACITOR AND BOARD HAVING THE SAME MOUNTED THEREON
    9.
    发明申请
    MULTILAYER CAPACITOR AND BOARD HAVING THE SAME MOUNTED THEREON 有权

    公开(公告)号：US20220301783A1

    公开(公告)日：2022-09-22

    申请号：US17836383

    申请日：2022-06-09

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： San Kyeong ,  Chang Hak Choi ,  Jae Seok Yi ,  Bon Seok Koo ,  Jung Min Kim ,  Hae Sol Kang ,  Jun Hyeon Kim

    IPC: H01G4/30 ,  H01G4/012 ,  H01G2/06 ,  H01G4/008 ,  H01G4/12

    Abstract: A multilayer capacitor includes a capacitor body including a dielectric layer and a plurality of internal electrodes, and external electrodes disposed on both ends of the capacitor body and connected to exposed portions of the plurality of internal electrodes, respectively. Each of the external electrodes includes a conductive layer disposed on the capacitor body to be connected to one or more of the plurality of internal electrodes, a conductive resin layer covering the conductive layer, and including a plurality of metal particles, a plurality of elastic fine powder particles each having an elastic powder particle and a metal film plated on a surface of the elastic powder particle, and a conductive resin surrounding the plurality of metal particles and the plurality of elastic fine powder particles and contacting the conductive layer, and a plating layer covering the conductive resin layer.

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